Part Details for 74LVC1G18GV-Q100H by NXP Semiconductors
Overview of 74LVC1G18GV-Q100H by NXP Semiconductors
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Part Details for 74LVC1G18GV-Q100H
74LVC1G18GV-Q100H CAD Models
74LVC1G18GV-Q100H Part Data Attributes
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74LVC1G18GV-Q100H
NXP Semiconductors
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74LVC1G18GV-Q100H
NXP Semiconductors
74LVC1G18-Q100 - 1-of-2 non-inverting demultiplexer with 3-state deselected output TSOP 6-Pin
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Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | TSOP | |
Package Description | PLASTIC, SC-74, SOT-457, TSOP-6 | |
Pin Count | 6 | |
Manufacturer Package Code | SOT457 | |
Reach Compliance Code | compliant | |
Family | LVC/LCX/Z | |
JESD-30 Code | R-PDSO-G6 | |
Length | 2.9 mm | |
Load Capacitance (CL) | 50 pF | |
Logic IC Type | MULTIPLEXER AND DEMUX/DECODER | |
Max I(ol) | 0.024 A | |
Number of Functions | 1 | |
Number of Inputs | 1 | |
Number of Outputs | 2 | |
Number of Terminals | 6 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Output Characteristics | 3-STATE | |
Output Polarity | TRUE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TSSOP | |
Package Equivalence Code | TSOP6,.11,37 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
Packing Method | TR | |
Prop. Delay@Nom-Sup | 6.3 ns | |
Propagation Delay (tpd) | 12.5 ns | |
Qualification Status | Not Qualified | |
Screening Level | AEC-Q100 | |
Seated Height-Max | 1.1 mm | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 1.65 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.95 mm | |
Terminal Position | DUAL | |
Width | 1.5 mm |