Part Details for 74LVC574APW by Philips Semiconductors
Results Overview of 74LVC574APW by Philips Semiconductors
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Energy and Power Systems
74LVC574APW Information
74LVC574APW by Philips Semiconductors is an FF/Latch.
FF/Latches are under the broader part category of Logic Components.
Digital logic governs the behavior of signals in electronic circuits, enabling complex decisions based on simple binary inputs (yes/no). Logic components perform operations from these signals. Read more about Logic Components on our Logic part category page.
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| SN74LVC574APWG4 | Texas Instruments | Octal Edge-Triggered D-Type Flip-Flop With 3-State Outputs 20-TSSOP -40 to 125 | |
| SN74LVC574APWR | Texas Instruments | Octal Edge-Triggered D-Type Flip-Flop With 3-State Outputs 20-TSSOP -40 to 125 | |
| SN74LVC574APW | Texas Instruments | Octal Edge-Triggered D-Type Flip-Flop With 3-State Outputs 20-TSSOP -55 to 125 |
Part Details for 74LVC574APW
74LVC574APW CAD Models
74LVC574APW Part Data Attributes
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74LVC574APW
Philips Semiconductors
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Datasheet
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74LVC574APW
Philips Semiconductors
D Flip-Flop, 8-Func, Positive Edge Triggered, CMOS, PDSO20
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | PHILIPS SEMICONDUCTORS | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| JESD-30 Code | R-PDSO-G20 | |
| Load Capacitance (CL) | 50 pF | |
| Logic IC Type | D FLIP-FLOP | |
| Max Frequency@Nom-Sup | 100000000 Hz | |
| Max I(ol) | 0.024 A | |
| Number of Functions | 8 | |
| Number of Terminals | 20 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSSOP | |
| Package Equivalence Code | TSSOP20,.25 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
| Packing Method | TUBE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Prop. Delay@Nom-Sup | 9 ns | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.635 mm | |
| Terminal Position | DUAL | |
| Trigger Type | POSITIVE EDGE |