Part Details for 74VHC14BQ,115 by NXP Semiconductors
Overview of 74VHC14BQ,115 by NXP Semiconductors
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Part Details for 74VHC14BQ,115
74VHC14BQ,115 CAD Models
74VHC14BQ,115 Part Data Attributes
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74VHC14BQ,115
NXP Semiconductors
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Datasheet
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74VHC14BQ,115
NXP Semiconductors
74VHC(T)14 - Hex inverting Schmitt trigger QFN 14-Pin
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Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | QFN | |
Package Description | HVQCCN, LCC14,.1X.12,20 | |
Pin Count | 14 | |
Manufacturer Package Code | SOT762-1 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
Family | AHC/VHC/H/U/V | |
JESD-30 Code | R-PQCC-N14 | |
JESD-609 Code | e3 | |
Length | 3 mm | |
Load Capacitance (CL) | 50 pF | |
Logic IC Type | INVERTER | |
Max I(ol) | 0.008 A | |
Moisture Sensitivity Level | 1 | |
Number of Functions | 6 | |
Number of Inputs | 1 | |
Number of Terminals | 14 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HVQCCN | |
Package Equivalence Code | LCC14,.1X.12,20 | |
Package Shape | RECTANGULAR | |
Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
Packing Method | TR | |
Peak Reflow Temperature (Cel) | 260 | |
Prop. Delay@Nom-Sup | 13.5 ns | |
Propagation Delay (tpd) | 10 ns | |
Qualification Status | Not Qualified | |
Schmitt Trigger | YES | |
Seated Height-Max | 1 mm | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Finish | MATTE TIN | |
Terminal Form | NO LEAD | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 2.5 mm |