Part Details for 89HPES5T5ZBBCGI by Renesas Electronics Corporation
Results Overview of 89HPES5T5ZBBCGI by Renesas Electronics Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- Tariff Estimator: (Available) NEW
- Number of Functional Equivalents: (5 options)
- CAD Models: (Available)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Renewable Energy
Robotics and Drones
89HPES5T5ZBBCGI Information
89HPES5T5ZBBCGI by Renesas Electronics Corporation is a Bus Controller.
Bus Controllers are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for 89HPES5T5ZBBCGI
| Part # | Distributor | Description | Stock | Price | Buy | |
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Chip Stock | BGA-196(15x15)Interface-SpecializedROHS | 725 |
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RFQ |
US Tariff Estimator: 89HPES5T5ZBBCGI by Renesas Electronics Corporation
Calculations from this tool are estimations only for imports into the United States. Please refer to the distributor or manufacturer and reference official US government sources and authorities to verify any final purchase costs.
Part Details for 89HPES5T5ZBBCGI
89HPES5T5ZBBCGI CAD Models
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89HPES5T5ZBBCGI Part Data Attributes
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89HPES5T5ZBBCGI
Renesas Electronics Corporation
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Datasheet
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89HPES5T5ZBBCGI
Renesas Electronics Corporation
5-lane, 5-port PCIe I/O Expansion Switch, CABGA126/Tray
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
| Part Package Code | CABGA | |
| Package Description | CABGA-196 | |
| Pin Count | 196 | |
| Manufacturer Package Code | BCG196 | |
| Reach Compliance Code | Compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Renesas Electronics | |
| Additional Feature | ALSO REQUIRES 3.3V SUPPLY | |
| Address Bus Width | ||
| Bus Compatibility | SMBUS | |
| Clock Frequency-Max | 125 MHz | |
| Data Transfer Rate-Max | 2500 MBps | |
| External Data Bus Width | ||
| JESD-30 Code | S-PBGA-B196 | |
| JESD-609 Code | e1 | |
| Length | 15 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 196 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA196,14X14,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.76 mm | |
| Supply Current-Max | 385 mA | |
| Supply Voltage-Max | 1.1 V | |
| Supply Voltage-Min | 0.9 V | |
| Supply Voltage-Nom | 1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 15 mm | |
| uPs/uCs/Peripheral ICs Type | BUS CONTROLLER, PCI |
Alternate Parts for 89HPES5T5ZBBCGI
This table gives cross-reference parts and alternative options found for 89HPES5T5ZBBCGI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 89HPES5T5ZBBCGI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| 89HPES5T5ZBBCG | Integrated Device Technology Inc | $17.9109 | CABGA-196, Tray | 89HPES5T5ZBBCGI vs 89HPES5T5ZBBCG |
| 89HPES5T5ZBBC | Integrated Device Technology Inc | Check for Price | CABGA-196, Tray | 89HPES5T5ZBBCGI vs 89HPES5T5ZBBC |
| 89HPES5T5ZBBCG | Renesas Electronics Corporation | Check for Price | 5-lane, 5-port PCIe I/O Expansion Switch, CABGA126/Tray | 89HPES5T5ZBBCGI vs 89HPES5T5ZBBCG |
| 89HPES5T5ZBBCI | Integrated Device Technology Inc | Check for Price | CABGA-196, Tray | 89HPES5T5ZBBCGI vs 89HPES5T5ZBBCI |
| 89HPES5T5ZBBCGI | Integrated Device Technology Inc | Check for Price | CABGA-196, Tray | 89HPES5T5ZBBCGI vs 89HPES5T5ZBBCGI |
89HPES5T5ZBBCGI Frequently Asked Questions (FAQ)
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Renesas recommends a 4-layer PCB with a solid ground plane and thermal vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended for the top and bottom layers.
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Implement a robust clock synchronization mechanism, use a common mode filter to reduce EMI, and ensure proper termination and impedance matching on the bus lines.
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Renesas recommends a power-on sequence of VCC, then VCCIO, and finally VREF. The voltage ramp-up rate should be limited to 10mV/μs to prevent latch-up and ensure reliable startup.
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Implement a robust error handling mechanism using the device's built-in error detection and correction features. Use interrupts and status registers to detect and respond to errors, and consider implementing a watchdog timer for added reliability.
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The device has a maximum junction temperature of 150°C. Ensure good airflow, use a heat sink if necessary, and avoid thermal hotspots on the PCB. Renesas provides a thermal model for simulation and design optimization.