Part Details for 89HP0504PZBABG8 by Renesas Electronics Corporation
Overview of 89HP0504PZBABG8 by Renesas Electronics Corporation
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Available Datasheets
Part # | Manufacturer | Description | Datasheet |
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89HP0504PZBABG8 | Renesas Electronics Corporation | PCIe Gen2 Signal Repeater |
Price & Stock for 89HP0504PZBABG8
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
89HP0504PZBABG8-ND
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DigiKey | IC INTFACE SPECIALIZED 100CABGA Lead time: 24 Weeks Container: Tape & Reel (TR) | Limited Supply - Call |
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Buy Now | |
DISTI #
89HP0504PZBABG8
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Avnet Silica | PCIe Gen2 Signal Repeater (Alt: 89HP0504PZBABG8) RoHS: Compliant Min Qty: 2000 Package Multiple: 2000 Lead time: 25 Weeks, 0 Days | Silica - 0 |
|
Buy Now |
Part Details for 89HP0504PZBABG8
89HP0504PZBABG8 CAD Models
89HP0504PZBABG8 Part Data Attributes
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89HP0504PZBABG8
Renesas Electronics Corporation
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Datasheet
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89HP0504PZBABG8
Renesas Electronics Corporation
PCIe Gen2 Signal Repeater, CABGA0/Reel
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | End Of Life | |
Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
Part Package Code | CABGA | |
Package Description | FBGA-100 | |
Pin Count | 100 | |
Manufacturer Package Code | ABG100 | |
Reach Compliance Code | compliant | |
ECCN Code | NLR | |
HTS Code | 8542390001 | |
Factory Lead Time | 26 Weeks, 1 Day | |
Samacsys Manufacturer | Renesas Electronics | |
Additional Feature | ALSO AVAILABLE 3.3V SUPPLY-NOM FOR I2C | |
Consumer IC Type | CONSUMER CIRCUIT | |
JESD-30 Code | S-PBGA-B100 | |
JESD-609 Code | e1 | |
Length | 9 mm | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 100 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA100,10X10,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 1.7 mm | |
Supply Voltage-Max (Vsup) | 1.26 V | |
Supply Voltage-Min (Vsup) | 1.14 V | |
Surface Mount | YES | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 9 mm |