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3-lane, 3-port PCIe I/O Expansion Switch, CABGA160/Tray
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89HPES3T3ZBBCG by Renesas Electronics Corporation is a Bus Controller.
Bus Controllers are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
89HPES3T3ZBBCG
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Avnet Silica | 3lane 3port PCIe IO Expansion Switch (Alt: 89HPES3T3ZBBCG) RoHS: Compliant Min Qty: 160 Package Multiple: 160 Lead time: 143 Weeks, 0 Days | Silica - 0 |
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89HPES3T3ZBBCG
Renesas Electronics Corporation
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Datasheet
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89HPES3T3ZBBCG
Renesas Electronics Corporation
3-lane, 3-port PCIe I/O Expansion Switch, CABGA160/Tray
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
Part Package Code | CABGA | |
Pin Count | 144 | |
Manufacturer Package Code | BCG144 | |
Reach Compliance Code | compliant | |
ECCN Code | NLR | |
HTS Code | 8542390001 | |
Samacsys Manufacturer | Renesas Electronics | |
Address Bus Width | ||
Bus Compatibility | PCI | |
Clock Frequency-Max | 100 MHz | |
Data Transfer Rate-Max | 312.5 MBps | |
External Data Bus Width | ||
JESD-30 Code | S-PBGA-B144 | |
JESD-609 Code | e1 | |
Length | 13 mm | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 144 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA144,12X12,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.5 mm | |
Supply Voltage-Max | 1.1 V | |
Supply Voltage-Min | 0.9 V | |
Supply Voltage-Nom | 1 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 13 mm | |
uPs/uCs/Peripheral ICs Type | BUS CONTROLLER, PCI |
Renesas provides a recommended PCB layout guide in their application note (APN) documents, which can be found on their website. The guide includes thermal vias, heat sink recommendations, and PCB layer stack-up suggestions to ensure optimal thermal performance.
Renesas recommends a specific power sequencing scheme to ensure proper device operation. This information can be found in the device's user manual or application notes. Typically, the sequence involves powering up the VCC, then the VDD, and finally the VPP supplies.
Renesas recommends using high-quality, low-ESR decoupling capacitors with a value of 0.1uF to 1uF, placed as close as possible to the device's power pins. The exact capacitor values and placement can be found in the device's datasheet or application notes.
Renesas provides troubleshooting guidelines for I2C interface issues in their application notes and user manuals. Common issues include incorrect pull-up resistor values, bus contention, and clock stretching. Engineers can use tools like logic analyzers and oscilloscopes to debug the I2C bus.
The 89HPES3T3ZBBCG has an operating temperature range of -40°C to +125°C. However, the device's performance and reliability may degrade at extreme temperatures. Engineers should consult the datasheet and application notes for specific temperature-related guidelines.