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Part Details for 8T33FS314PGGI by Renesas Electronics Corporation
Overview of 8T33FS314PGGI by Renesas Electronics Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for 8T33FS314PGGI
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
8T33FS314PGGI
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Avnet Americas | Low Skew, 1-to-4 Differential-to-2.5V, 3.3V LVPECL/ECL Fanout Buffer - Rail/Tube (Alt: 8T33FS314PGGI) RoHS: Compliant Min Qty: 108 Package Multiple: 1 Lead time: 0 Weeks, 2 Days Container: Tube | 8453 Partner Stock |
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$5.8801 / $6.7135 | Buy Now |
Part Details for 8T33FS314PGGI
8T33FS314PGGI CAD Models
8T33FS314PGGI Part Data Attributes
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8T33FS314PGGI
Renesas Electronics Corporation
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Datasheet
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8T33FS314PGGI
Renesas Electronics Corporation
Low Skew, 1-to-4 Differential-to-2.5V, 3.3V LVPECL/ECL Fanout Buffer, TSSOP74/Tube
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
| Part Package Code | TSSOP | |
| Package Description | TSSOP-20 | |
| Pin Count | 20 | |
| Manufacturer Package Code | PGG20 | |
| Reach Compliance Code | compliant | |
| ECCN Code | NLR | |
| HTS Code | 8542390001 | |
| Factory Lead Time | 2 Days | |
| Samacsys Manufacturer | Renesas Electronics | |
| Family | 8T | |
| Input Conditioning | DIFFERENTIAL MUX | |
| JESD-30 Code | R-PDSO-G20 | |
| JESD-609 Code | e3 | |
| Length | 5 mm | |
| Logic IC Type | LOW SKEW CLOCK DRIVER | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Inverted Outputs | ||
| Number of Terminals | 20 | |
| Number of True Outputs | 8 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSSOP | |
| Package Equivalence Code | TSSOP20,.25 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
| Packing Method | TUBE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Power Supply Current-Max (ICC) | 60 mA | |
| Prop. Delay@Nom-Sup | 0.65 ns | |
| Propagation Delay (tpd) | 0.65 ns | |
| Same Edge Skew-Max (tskwd) | 0.05 ns | |
| Seated Height-Max | 1.2 mm | |
| Supply Voltage-Max (Vsup) | 2.625 V | |
| Supply Voltage-Min (Vsup) | 2.375 V | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Terminal Finish | TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | DUAL | |
| Width | 4.4 mm | |
| fmax-Min | 2700 MHz |