Part Details for 935313983557 by NXP Semiconductors
Overview of 935313983557 by NXP Semiconductors
- Distributor Offerings:
- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Transportation and Logistics
Renewable Energy
Automotive
Robotics and Drones
Part Details for 935313983557
935313983557 CAD Models
935313983557 Part Data Attributes
|
|
935313983557
NXP Semiconductors
Buy Now
Datasheet
|
Compare Parts:
935313983557
NXP Semiconductors
Microcontroller
|
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | HBGA, | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.31.00.01 | |
| Has ADC | YES | |
| Address Bus Width | 24 | |
| Bit Size | 32 | |
| CPU Family | E200 | |
| Clock Frequency-Max | 20 MHz | |
| DMA Channels | YES | |
| External Data Bus Width | 32 | |
| JESD-30 Code | S-PBGA-B416 | |
| JESD-609 Code | e4 | |
| Length | 27 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of I/O Lines | 256 | |
| Number of Terminals | 416 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA416,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 131072 | |
| ROM (words) | 3145728 | |
| ROM Programmability | FLASH | |
| Screening Level | AEC-Q100 | |
| Speed | 135 MHz | |
| Supply Current-Max | 785 mA | |
| Supply Voltage-Max | 1.65 V | |
| Supply Voltage-Min | 1.35 V | |
| Supply Voltage-Nom | 1.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | NICKEL GOLD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 27 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |