Part Details for A3P1000-FG256I by Microchip Technology Inc
Results Overview of A3P1000-FG256I by Microchip Technology Inc
- Distributor Offerings: (7 listings)
- Number of FFF Equivalents: (3 replacements)
- Tariff Estimator: (Available) NEW
- Number of Functional Equivalents: (10 options)
- CAD Models: (Request Part)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
A3P1000-FG256I Information
A3P1000-FG256I by Microchip Technology Inc is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for A3P1000-FG256I
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
33AJ1837
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Newark | Proasic3 Fpga, 11Kles 256 Lfbga 17X17X1.7Mm Tray Rohs Compliant: Yes |Microchip A3P1000-FG256I RoHS: Compliant Min Qty: 90 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$88.2400 / $99.2900 | Buy Now |
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DISTI #
A3P1000-FG256I
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Avnet Americas | - Trays (Alt: A3P1000-FG256I) COO: China RoHS: Not Compliant Min Qty: 90 Package Multiple: 90 Lead time: 12 Weeks, 0 Days Container: Tray | 0 |
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$87.3625 / $99.8429 | Buy Now |
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DISTI #
A3P1000-FG256I
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Microchip Technology Inc | ProASIC3 FPGA, 11KLEs, LFBGA, Projected EOL: 2049-02-04 COO: Malaysia ECCN: EAR99 RoHS: Compliant Container: Tray | In Stock: 1 and Alternates Available |
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$51.6600 / $100.8600 | Buy Now |
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NAC | ProASIC3 FPGA, 11KLEs. Package: 256 LFBGA 17x17x1.7mm TRAY - FPGA Flash Product Line RoHS: Compliant Min Qty: 90 Package Multiple: 90 Container: Tray | 0 |
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$85.2300 / $99.8400 | Buy Now |
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DISTI #
A3P1000-FG256I
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Avnet Silica | (Alt: A3P1000-FG256I) RoHS: Not Compliant Min Qty: 90 Package Multiple: 90 Lead time: 14 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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Chip Stock | FPGAProASIC3Family1MGates231MHz130nm(CMOS)Technology1.5V256-PinFBGA | 815 |
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RFQ | |
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DISTI #
A3P1000-FG256I
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EBV Elektronik | (Alt: A3P1000-FG256I) RoHS: Not Compliant Min Qty: 90 Package Multiple: 90 Lead time: 13 Weeks, 0 Days | EBV - 0 |
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Buy Now |
US Tariff Estimator: A3P1000-FG256I by Microchip Technology Inc
Calculations from this tool are estimations only for imports into the United States. Please refer to the distributor or manufacturer and reference official US government sources and authorities to verify any final purchase costs.
Part Details for A3P1000-FG256I
A3P1000-FG256I Part Data Attributes
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A3P1000-FG256I
Microchip Technology Inc
Buy Now
Datasheet
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Compare Parts:
A3P1000-FG256I
Microchip Technology Inc
ProASIC3 FPGA, 11KLEs
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| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Package Description | Bga, Bga256,16x16,40 | |
| Pin Count | 256 | |
| Manufacturer Package Code | LFBGA-256 | |
| Reach Compliance Code | Not Compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.31.00.01 | |
| Clock Frequency-Max | 350 Mhz | |
| JESD-30 Code | S-PBGA-B256 | |
| JESD-609 Code | e0 | |
| Length | 17 Mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 24576 | |
| Number of Equivalent Gates | 1000000 | |
| Number of Inputs | 177 | |
| Number of Outputs | 177 | |
| Number of Terminals | 256 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 24576 Clbs, 1000000 Gates | |
| Package Body Material | Plastic/Epoxy | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | Square | |
| Package Style | Grid Array | |
| Packing Method | Tray | |
| Programmable Logic Type | Field Programmable Gate Array | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.8 Mm | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| Supply Voltage-Nom | 1.5 V | |
| Surface Mount | Yes | |
| Technology | Cmos | |
| Temperature Grade | Industrial | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | Ball | |
| Terminal Pitch | 1 Mm | |
| Terminal Position | Bottom | |
| Width | 17 Mm |
Alternate Parts for A3P1000-FG256I
This table gives cross-reference parts and alternative options found for A3P1000-FG256I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of A3P1000-FG256I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| A3P1000-FGG256I | Microchip Technology Inc | $111.4480 | ProASIC3 FPGA, 11KLEs | A3P1000-FG256I vs A3P1000-FGG256I |
| A3P1000-FG256 | Microchip Technology Inc | $97.9754 | ProASIC3 FPGA, 11KLEs | A3P1000-FG256I vs A3P1000-FG256 |
| A3P1000-FG256YC | Microchip Technology Inc | Check for Price | Field Programmable Gate Array, 1000000 Gates, 350MHz, 24576-Cell, CMOS, PBGA256 | A3P1000-FG256I vs A3P1000-FG256YC |
A3P1000-FG256I Frequently Asked Questions (FAQ)
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Microchip provides a reference design and PCB layout guidelines in the A3P1000-FG256I Development Kit documentation. It's recommended to follow a 4-6 layer stackup with a solid ground plane, and to use a 50-ohm impedance-controlled routing for high-speed signals.
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A 4-layer PDN with a separate power plane for each voltage rail is recommended. Use a combination of capacitors with different values and types to decouple the power rails, and follow the decoupling capacitor placement guidelines in the datasheet.
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Use a heat sink with a thermal interface material, and ensure good airflow around the FPGA. Follow the thermal design guidelines in the datasheet, and consider using a thermal simulation tool to optimize the design.
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Use a secure boot mechanism, such as AES encryption and authentication, to protect the FPGA configuration. Implement a robust configuration management system, and consider using a secure boot loader and firmware.
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Follow the high-speed design guidelines in the datasheet, and use a signal integrity analysis tool to optimize the design. Implement proper termination, routing, and shielding techniques to minimize EMI.