Part Details for ADG884BCBZ-REEL7 by Analog Devices Inc
Results Overview of ADG884BCBZ-REEL7 by Analog Devices Inc
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (3 replacements)
- Tariff Estimator: (Available) NEW
- Number of Functional Equivalents: (10 options)
- CAD Models: (Available)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
ADG884BCBZ-REEL7 Information
ADG884BCBZ-REEL7 by Analog Devices Inc is a Multiplexer or Switch.
Multiplexers or Switches are under the broader part category of Signal Circuits.
A signal is an electronic means of transmitting information, either as an analog signal with continuous values or a digital signal with discrete values. Signals are used in various systems and networks. Read more about Signal Circuits on our Signal Circuits part category page.
Price & Stock for ADG884BCBZ-REEL7
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
80AK8644
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Newark | Analogue Switch, 2-Channel, Spdt, Wlcsp Rohs Compliant: Yes |Analog Devices ADG884BCBZ-REEL7 RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Cut Tape | 2900 |
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$1.6000 / $4.6300 | Buy Now |
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Analog Devices Inc | DUAL 2:1 MUX. IC. Min Qty: 1 Package Multiple: 3000 | 1293 |
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$1.6000 / $4.6300 | Buy Now |
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Win Source Electronics | IC SWITCH DUAL SPDT 10WLCSP | 56970 |
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$1.3715 / $1.7714 | Buy Now |
US Tariff Estimator: ADG884BCBZ-REEL7 by Analog Devices Inc
Calculations from this tool are estimations only for imports into the United States. Please refer to the distributor or manufacturer and reference official US government sources and authorities to verify any final purchase costs.
Part Details for ADG884BCBZ-REEL7
ADG884BCBZ-REEL7 CAD Models
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ADG884BCBZ-REEL7 Part Data Attributes
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ADG884BCBZ-REEL7
Analog Devices Inc
Buy Now
Datasheet
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ADG884BCBZ-REEL7
Analog Devices Inc
0.5 Ω CMOS Dual 2:1 MUX/SPDT Audio Switch
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| Pbfree Code | No | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Part Package Code | BGA | |
| Package Description | Vfbga, Bga10,3x4,20 | |
| Pin Count | 10 | |
| Manufacturer Package Code | CB-10-1 | |
| Reach Compliance Code | Compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Analog IC - Other Type | Audio/Video Switch | |
| JESD-30 Code | R-XBGA-B10 | |
| JESD-609 Code | e1 | |
| Length | 2 Mm | |
| Moisture Sensitivity Level | 1 | |
| Number of Channels | 1 | |
| Number of Functions | 2 | |
| Number of Terminals | 10 | |
| Off-state Isolation-Nom | 60 Db | |
| On-state Resistance Match-Nom | 0.02 Ω | |
| On-state Resistance-Max (Ron) | 0.5 Ω | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Output | Separate Output | |
| Package Body Material | Unspecified | |
| Package Code | VFBGA | |
| Package Equivalence Code | BGA10,3X4,20 | |
| Package Shape | Rectangular | |
| Package Style | Grid Array, Very Thin Profile, Fine Pitch | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 0.63 Mm | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 1.8 V | |
| Supply Voltage-Nom (Vsup) | 2.7 V | |
| Surface Mount | Yes | |
| Switch-off Time-Max | 19 Ns | |
| Switch-on Time-Max | 56 Ns | |
| Switching | Break-Before-Make | |
| Technology | Cmos | |
| Temperature Grade | Industrial | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | Ball | |
| Terminal Pitch | 0.5 Mm | |
| Terminal Position | Bottom | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 1.5 Mm |
Alternate Parts for ADG884BCBZ-REEL7
This table gives cross-reference parts and alternative options found for ADG884BCBZ-REEL7. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of ADG884BCBZ-REEL7, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| ADG884BCBZ-500RL7 | Rochester Electronics LLC | Check for Price | DUAL 1-CHANNEL, AUDIO/VIDEO SWITCH, BGA10, LEAD FREE, WLCSP-10 | ADG884BCBZ-REEL7 vs ADG884BCBZ-500RL7 |
| ADG884BCBZ-REEL | Rochester Electronics LLC | Check for Price | DUAL 1-CHANNEL, AUDIO/VIDEO SWITCH, BGA10, LEAD FREE, WLCSP-10 | ADG884BCBZ-REEL7 vs ADG884BCBZ-REEL |
| ADG884BCBZ-REEL | Analog Devices Inc | Check for Price | DUAL 1-CHANNEL, AUDIO/VIDEO SWITCH, BGA10, LEAD FREE, WLCSP-10 | ADG884BCBZ-REEL7 vs ADG884BCBZ-REEL |
ADG884BCBZ-REEL7 Frequently Asked Questions (FAQ)
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A good PCB layout for the ADG884BCBZ-REEL7 involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the signal traces. It's also recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
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To ensure reliability in high-temperature applications, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using a thermally conductive material for the PCB, and ensuring good airflow around the device. Additionally, the device should be operated within its specified temperature range.
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To prevent ESD damage, it's recommended to handle the ADG884BCBZ-REEL7 in an ESD-controlled environment, use ESD-protective packaging, and wear an ESD wrist strap or use an ESD mat. Additionally, the device should be stored in an anti-static bag or container when not in use.
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The ADG884BCBZ-REEL7 is not specifically designed or tested for radiation-hardened applications. If radiation hardness is required, it's recommended to consult with Analog Devices Inc. or use a radiation-hardened equivalent device.
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The recommended soldering profile for the ADG884BCBZ-REEL7 involves a peak temperature of 260°C, a dwell time above 217°C of 20-40 seconds, and a total process time of 60-90 seconds. It's essential to follow the recommended soldering profile to prevent damage to the device.