Part Details for APA150-FGG144IX95 by Microchip Technology Inc
Overview of APA150-FGG144IX95 by Microchip Technology Inc
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Applications
Energy and Power Systems
Renewable Energy
Automotive
Part Details for APA150-FGG144IX95
APA150-FGG144IX95 CAD Models
APA150-FGG144IX95 Part Data Attributes
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APA150-FGG144IX95
Microchip Technology Inc
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APA150-FGG144IX95
Microchip Technology Inc
Field Programmable Gate Array, CMOS, PBGA144
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
Package Description | 1 MM PITCH, ROHS COMPLIANT, FBGA-144 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
JESD-30 Code | S-PBGA-B144 | |
JESD-609 Code | e1 | |
Length | 13 mm | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 144 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA144,12X12,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Peak Reflow Temperature (Cel) | 260 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.55 mm | |
Supply Voltage-Max | 2.7 V | |
Supply Voltage-Min | 2.3 V | |
Supply Voltage-Nom | 2.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 13 mm |