Part Details for AS27C256A-55JM/MIL by Micross Components
Overview of AS27C256A-55JM/MIL by Micross Components
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- Number of Functional Equivalents:
- Part Data Attributes
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Part Details for AS27C256A-55JM/MIL
AS27C256A-55JM/MIL CAD Models
AS27C256A-55JM/MIL Part Data Attributes
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AS27C256A-55JM/MIL
Micross Components
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Datasheet
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AS27C256A-55JM/MIL
Micross Components
UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | AUSTIN SEMICONDUCTOR INC | |
| Part Package Code | DIP | |
| Package Description | DIP, | |
| Pin Count | 28 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 55 ns | |
| JESD-30 Code | R-CDIP-T28 | |
| Memory Density | 262144 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 32KX8 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.8928 mm | |
| Supply Current-Max | 0.001 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 7.62 mm |
Alternate Parts for AS27C256A-55JM/MIL
This table gives cross-reference parts and alternative options found for AS27C256A-55JM/MIL. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AS27C256A-55JM/MIL, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| CY27C256-55WC | UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Cypress Semiconductor | AS27C256A-55JM/MIL vs CY27C256-55WC |
| 5962-8606309UX | 32KX8 UVPROM, 55ns, CDIP28, CERAMIC, DIP-28 | STMicroelectronics | AS27C256A-55JM/MIL vs 5962-8606309UX |
| 5662-860639XA | UVPROM, 32KX8, 55ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | e2v technologies | AS27C256A-55JM/MIL vs 5662-860639XA |
| AS27C256A-55JM | Memory IC | Micross Components | AS27C256A-55JM/MIL vs AS27C256A-55JM |
| 5962-8606309XA | 32KX8 UVPROM, 55ns, CDIP28, CERAMIC, DIP-28 | STMicroelectronics | AS27C256A-55JM/MIL vs 5962-8606309XA |
| 5962-8981701XX | UVPROM, 32KX8, 55ns, CMOS, CDIP28, CERAMIC, DIP-28 | e2v technologies | AS27C256A-55JM/MIL vs 5962-8981701XX |
| 5662-8606319YA | UVPROM, 32KX8, 55ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | e2v technologies | AS27C256A-55JM/MIL vs 5662-8606319YA |
| WS57C256F-55DMB | UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 | e2v technologies | AS27C256A-55JM/MIL vs WS57C256F-55DMB |
| WS57C256F-55T | UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.300 INCH, CERDIP-28 | Waferscale Integration Inc | AS27C256A-55JM/MIL vs WS57C256F-55T |
| 5662-8606319QYA | UVPROM, 32KX8, 55ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | e2v technologies | AS27C256A-55JM/MIL vs 5662-8606319QYA |