Datasheets
AX500-2FGG676M by:

Field Programmable Gate Array, 5376 CLBs, 500000 Gates, CMOS, PBGA676, 1 MM PITCH, ROHS COMPLIANT, FBGA-676

Part Details for AX500-2FGG676M by Microsemi Corporation

Overview of AX500-2FGG676M by Microsemi Corporation

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Applications Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Medical Imaging Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Healthcare Communication and Networking Entertainment and Gaming Robotics and Drones

Part Details for AX500-2FGG676M

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AX500-2FGG676M Part Data Attributes:

AX500-2FGG676M Microsemi Corporation
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AX500-2FGG676M Microsemi Corporation Field Programmable Gate Array, 5376 CLBs, 500000 Gates, CMOS, PBGA676, 1 MM PITCH, ROHS COMPLIANT, FBGA-676
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer MICROSEMI CORP
Package Description BGA,
Reach Compliance Code compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.39.00.01
JESD-30 Code S-PBGA-B676
JESD-609 Code e1
Length 27 mm
Moisture Sensitivity Level 3
Number of CLBs 5376
Number of Equivalent Gates 500000
Number of Terminals 676
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 5376 CLBS, 500000 GATES
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Screening Level MIL-STD-883 Class B
Seated Height-Max 2.44 mm
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
Supply Voltage-Nom 1.5 V
Surface Mount YES
Technology CMOS
Temperature Grade MILITARY
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 27 mm

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