Part Details for BA6569AFPE2 by ROHM Semiconductor
Overview of BA6569AFPE2 by ROHM Semiconductor
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Part Details for BA6569AFPE2
BA6569AFPE2 CAD Models
BA6569AFPE2 Part Data Attributes
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BA6569AFPE2
ROHM Semiconductor
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Datasheet
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BA6569AFPE2
ROHM Semiconductor
TELEPHONE SPEECH CKT, PDSO26, POWER, HSOP-24
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ROHM CO LTD | |
| Part Package Code | SOIC | |
| Package Description | HSSOP, | |
| Pin Count | 24 | |
| Reach Compliance Code | unknown | |
| JESD-30 Code | R-PDSO-G26 | |
| JESD-609 Code | e3/e2 | |
| Length | 13.6 mm | |
| Number of Functions | 1 | |
| Number of Terminals | 26 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HSSOP | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.11 mm | |
| Surface Mount | YES | |
| Telecom IC Type | TELEPHONE SPEECH CKT | |
| Terminal Finish | TIN/TIN COPPER | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 10 | |
| Width | 5.4 mm |