Part Details for BGX7220HN/1,518 by NXP Semiconductors
Overview of BGX7220HN/1,518 by NXP Semiconductors
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- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Energy and Power Systems
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Consumer Electronics
Audio and Video Systems
Computing and Data Storage
Healthcare
Renewable Energy
Communication and Networking
Robotics and Drones
Part Details for BGX7220HN/1,518
BGX7220HN/1,518 CAD Models
BGX7220HN/1,518 Part Data Attributes
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BGX7220HN/1,518
NXP Semiconductors
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Datasheet
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BGX7220HN/1,518
NXP Semiconductors
BGX7220HN - Dual receiver down mixer QFN 36-Pin
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | QFN | |
Package Description | HVQFN-36 | |
Pin Count | 36 | |
Manufacturer Package Code | SOT1092-2 | |
Reach Compliance Code | compliant | |
Consumer IC Type | RECEIVER IC | |
JESD-30 Code | S-PQCC-N36 | |
Length | 6 mm | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 36 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HVQCCN | |
Package Equivalence Code | LCC36,24SQ,20 | |
Package Shape | SQUARE | |
Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 1 mm | |
Supply Current-Max | 355 mA | |
Supply Voltage-Max (Vsup) | 5.25 V | |
Supply Voltage-Min (Vsup) | 4.75 V | |
Surface Mount | YES | |
Terminal Form | NO LEAD | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Transmission Media | RF | |
Width | 6 mm |