| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
| Rochester Electronics | BQ51011 Generation 2 Integrated Wireless Power Receiver Solution, Qi (Wireless Power Consortium) Compliant RoHS: Compliant Status: Not Recommended for New Designs Min Qty: 1 | 3000 |
|
$3.5800 / $4.2100 | Buy Now |
|
|
|
|---|---|
|
Pbfree Code
|
Yes
|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
End Of Life
|
|
Ihs Manufacturer
|
TEXAS INSTRUMENTS INC
|
|
Part Package Code
|
BGA
|
|
Package Description
|
DSBGA-28
|
|
Pin Count
|
28
|
|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
EAR99
|
|
HTS Code
|
8542.39.00.01
|
|
Samacsys Manufacturer
|
Texas Instruments
|
|
JESD-30 Code
|
R-XBGA-B28
|
|
JESD-609 Code
|
e1
|
|
Length
|
2.76 mm
|
|
Moisture Sensitivity Level
|
1
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
28
|
|
Operating Temperature-Max
|
125 °C
|
|
Operating Temperature-Min
|
|
|
Package Body Material
|
UNSPECIFIED
|
|
Package Code
|
VFBGA
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
|
Peak Reflow Temperature (Cel)
|
260
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
0.625 mm
|
|
Supply Voltage-Nom
|
5 V
|
|
Surface Mount
|
YES
|
|
Telecom IC Type
|
TELECOM CIRCUIT
|
|
Temperature Grade
|
OTHER
|
|
Terminal Finish
|
TIN SILVER COPPER
|
|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
0.4 mm
|
|
Terminal Position
|
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s)
|
30
|
|
Width
|
1.56 mm
|
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| BQ51011YFFT | Generation 2 Integrated Wireless Power Receiver Solution, Qi (Wireless Power Consortium) Compliant 28-DSBGA 0 to 125 | Texas Instruments | BQ51011YFFR vs BQ51011YFFT |
