Part Details for BU8272GUW by ROHM Semiconductor
Overview of BU8272GUW by ROHM Semiconductor
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Part Details for BU8272GUW
BU8272GUW CAD Models
BU8272GUW Part Data Attributes
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BU8272GUW
ROHM Semiconductor
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Datasheet
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BU8272GUW
ROHM Semiconductor
Parallel I/O Port, 20 I/O, CMOS, PBGA35, ROHS COMPLIANT, VBGA-35
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ROHM CO LTD | |
Part Package Code | BGA | |
Package Description | VFBGA, | |
Pin Count | 35 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
Clock Frequency-Max | 0.4 MHz | |
External Data Bus Width | ||
JESD-30 Code | S-PBGA-B35 | |
JESD-609 Code | e1 | |
Length | 4 mm | |
Number of I/O Lines | 20 | |
Number of Ports | 0 | |
Number of Terminals | 35 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | VFBGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
Seated Height-Max | 0.9 mm | |
Supply Voltage-Max | 1.95 V | |
Supply Voltage-Min | 1.65 V | |
Supply Voltage-Nom | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 0.5 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 4 mm | |
uPs/uCs/Peripheral ICs Type | PARALLEL IO PORT, GENERAL PURPOSE |