Part Details for CXP750000-U01S by Sony Semiconductor
Overview of CXP750000-U01S by Sony Semiconductor
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Part Details for CXP750000-U01S
CXP750000-U01S CAD Models
CXP750000-U01S Part Data Attributes
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CXP750000-U01S
Sony Semiconductor
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Datasheet
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CXP750000-U01S
Sony Semiconductor
Microcontroller, 8-Bit, UVPROM, SPC700 CPU, 24MHz, CMOS, CDIP64, CERAMIC, PSDIP-64
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | SONY CORP | |
| Part Package Code | DIP | |
| Package Description | CERAMIC, PSDIP-64 | |
| Pin Count | 64 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.31.00.01 | |
| Has ADC | YES | |
| Address Bus Width | 17 | |
| Bit Size | 8 | |
| CPU Family | SPC700 | |
| Clock Frequency-Max | 24 MHz | |
| DAC Channels | NO | |
| DMA Channels | NO | |
| External Data Bus Width | 8 | |
| JESD-30 Code | R-CDIP-T64 | |
| JESD-609 Code | e6/e4 | |
| Length | 58.9 mm | |
| Number of I/O Lines | 52 | |
| Number of Terminals | 64 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 75 °C | |
| Operating Temperature-Min | -20 °C | |
| PWM Channels | YES | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | ASDIP | |
| Package Equivalence Code | SDIP64,.75 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 2496 | |
| ROM (words) | 122880 | |
| ROM Programmability | UVPROM | |
| Seated Height-Max | 11.24 mm | |
| Speed | 24 MHz | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| Supply Voltage-Nom | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL EXTENDED | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 1.778 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 10 | |
| Width | 19.05 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |