Part Details for CY7C1470V25-200BZIT by Cypress Semiconductor
Overview of CY7C1470V25-200BZIT by Cypress Semiconductor
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (3 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for CY7C1470V25-200BZIT
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
19M6880
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Newark | Sync Srams/Reel |Cypress Infineon Technologies CY7C1470V25-200BZIT RoHS: Not Compliant Min Qty: 1000 Package Multiple: 1 Date Code: 0 Container: Reel | 0 |
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Buy Now | |
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Flip Electronics | Stock | 1703 |
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RFQ |
Part Details for CY7C1470V25-200BZIT
CY7C1470V25-200BZIT CAD Models
CY7C1470V25-200BZIT Part Data Attributes
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CY7C1470V25-200BZIT
Cypress Semiconductor
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Datasheet
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Compare Parts:
CY7C1470V25-200BZIT
Cypress Semiconductor
ZBT SRAM, 2MX36, 3ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
Package Description | 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.2.A | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 3 ns | |
Additional Feature | PIPELINED ARCHITECTURE | |
Clock Frequency-Max (fCLK) | 200 MHz | |
I/O Type | COMMON | |
JESD-30 Code | R-PBGA-B165 | |
JESD-609 Code | e0 | |
Length | 17 mm | |
Memory Density | 75497472 bit | |
Memory IC Type | ZBT SRAM | |
Memory Width | 36 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 165 | |
Number of Words | 2097152 words | |
Number of Words Code | 2000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 2MX36 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA165,11X15,40 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 220 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.4 mm | |
Standby Voltage-Min | 2.38 V | |
Supply Current-Max | 0.45 mA | |
Supply Voltage-Max (Vsup) | 2.625 V | |
Supply Voltage-Min (Vsup) | 2.375 V | |
Supply Voltage-Nom (Vsup) | 2.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 15 mm |
Alternate Parts for CY7C1470V25-200BZIT
This table gives cross-reference parts and alternative options found for CY7C1470V25-200BZIT. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY7C1470V25-200BZIT, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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CY7C1470V25-200BZI | ZBT SRAM, 2MX36, 3ns, CMOS, PBGA165, FBGA-165 | Cypress Semiconductor | CY7C1470V25-200BZIT vs CY7C1470V25-200BZI |
CY7C1470V25-200BZIT | ZBT SRAM, 2MX36, 3ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | Infineon Technologies AG | CY7C1470V25-200BZIT vs CY7C1470V25-200BZIT |
CY7C1470V25-200BZI | ZBT SRAM, 2MX36, 3ns, CMOS, PBGA165, FBGA-165 | Infineon Technologies AG | CY7C1470V25-200BZIT vs CY7C1470V25-200BZI |