Part Details for CY7C2644KV18-333BZI by Cypress Semiconductor
Overview of CY7C2644KV18-333BZI by Cypress Semiconductor
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (2 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (3 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for CY7C2644KV18-333BZI
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-CY7C2644KV18-333BZI-ND
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DigiKey | IC SRAM 144MBIT PAR 165FBGA Min Qty: 1 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT |
31 In Stock |
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$580.9000 | Buy Now |
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Bristol Electronics | 16 |
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RFQ | ||
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Rochester Electronics | QDR SRAM, 4MX36, 0.45ns PBGA165 ' RoHS: Not Compliant Status: Active Min Qty: 1 | 31 |
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$498.5100 / $586.4800 | Buy Now |
Part Details for CY7C2644KV18-333BZI
CY7C2644KV18-333BZI CAD Models
CY7C2644KV18-333BZI Part Data Attributes
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CY7C2644KV18-333BZI
Cypress Semiconductor
Buy Now
Datasheet
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Compare Parts:
CY7C2644KV18-333BZI
Cypress Semiconductor
QDR SRAM, 4MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165
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Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
Part Package Code | BGA | |
Package Description | 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | |
Pin Count | 165 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.2.A | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 0.45 ns | |
Additional Feature | PIPELINED ARCHITECTURE | |
Clock Frequency-Max (fCLK) | 333 MHz | |
I/O Type | SEPARATE | |
JESD-30 Code | R-PBGA-B165 | |
JESD-609 Code | e0 | |
Length | 17 mm | |
Memory Density | 150994944 bit | |
Memory IC Type | QDR SRAM | |
Memory Width | 36 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 165 | |
Number of Words | 4194304 words | |
Number of Words Code | 4000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 4MX36 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA165,11X15,40 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.4 mm | |
Standby Voltage-Min | 1.7 V | |
Supply Voltage-Max (Vsup) | 1.9 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 15 mm |
Alternate Parts for CY7C2644KV18-333BZI
This table gives cross-reference parts and alternative options found for CY7C2644KV18-333BZI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY7C2644KV18-333BZI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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CY7C2644KV18-333BZXI | QDR SRAM, 8MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | CY7C2644KV18-333BZI vs CY7C2644KV18-333BZXI |
CY7C2644KV18-333BZXI | QDR SRAM, 8MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Infineon Technologies AG | CY7C2644KV18-333BZI vs CY7C2644KV18-333BZXI |