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Overview of CYNSE70128-66BGC by Cypress Semiconductor
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- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
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- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for CYNSE70128-66BGC by Cypress Semiconductor
Part Data Attributes for CYNSE70128-66BGC by Cypress Semiconductor
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Pbfree Code
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No
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Rohs Code
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No
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Part Life Cycle Code
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Obsolete
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Ihs Manufacturer
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CYPRESS SEMICONDUCTOR CORP
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Part Package Code
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BGA
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Package Description
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35 X 35 MM, 2.33 MM HEIGHT, BGA-388
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Pin Count
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388
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Reach Compliance Code
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compliant
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HTS Code
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8542.39.00.01
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JESD-30 Code
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S-PBGA-B388
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JESD-609 Code
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e0
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Length
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35 mm
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Moisture Sensitivity Level
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3
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Number of Functions
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1
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Number of Terminals
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388
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Operating Temperature-Max
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70 °C
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Operating Temperature-Min
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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BGA
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Package Equivalence Code
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BGA388,26X26,50
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Package Shape
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SQUARE
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Package Style
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GRID ARRAY
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Peak Reflow Temperature (Cel)
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NOT SPECIFIED
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Qualification Status
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Not Qualified
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Seated Height-Max
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2.46 mm
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Supply Voltage-Nom
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1.5 V
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Surface Mount
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YES
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Telecom IC Type
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TELECOM CIRCUIT
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Temperature Grade
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COMMERCIAL
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Terminal Finish
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Tin/Lead (Sn/Pb)
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Terminal Form
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BALL
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Terminal Pitch
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1.27 mm
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Terminal Position
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BOTTOM
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Time@Peak Reflow Temperature-Max (s)
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NOT SPECIFIED
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Width
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35 mm
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