-
Part Symbol
-
Footprint
-
3D Model
Available Download Formats
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
Interface Circuit, 1-Trnsvr, BICMOS, PBGA100, BGA-100
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
89HPES16T4G2ZBBXI | Renesas Electronics Corporation | 16-lane, 4-port Gen2 PCIe I/O Expansion Switch | |
89HPES16T4G2ZBBXI8 | Renesas Electronics Corporation | 16-lane, 4-port Gen2 PCIe I/O Expansion Switch |
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
CYP15G0101DXB-BBXI
|
Avnet Americas | PHY 1-CH 195Mbps/1.5Gbps 100-Pin T-BGA - Trays (Alt: CYP15G0101DXB-BBXI) RoHS: Compliant Min Qty: 2 Package Multiple: 1 Lead time: 4 Weeks, 0 Days Container: Tray | 69 Partner Stock |
|
$180.6308 / $218.5050 | Buy Now |
|
Rochester Electronics | CYP15G0101DXB - Single-channel HOTLink II Transceiver RoHS: Compliant Status: Obsolete Min Qty: 1 | 4997 |
|
$180.5700 / $212.4300 | Buy Now |
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
|
CYP15G0101DXB-BBXI
Infineon Technologies AG
Buy Now
Datasheet
|
Compare Parts:
CYP15G0101DXB-BBXI
Infineon Technologies AG
Interface Circuit, 1-Trnsvr, BICMOS, PBGA100, BGA-100
|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
Package Description | BGA-100 | |
Reach Compliance Code | compliant | |
Factory Lead Time | 4 Weeks | |
Samacsys Manufacturer | Infineon | |
Data Rate | 1500000 Mbps | |
JESD-30 Code | S-PBGA-B100 | |
JESD-609 Code | e1 | |
Length | 11 mm | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 100 | |
Number of Transceivers | 1 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA100,10X10,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.4 mm | |
Supply Current-Max | 0.51 mA | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | BICMOS | |
Telecom IC Type | INTERFACE CIRCUIT | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 20 | |
Width | 11 mm |
This table gives cross-reference parts and alternative options found for CYP15G0101DXB-BBXI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CYP15G0101DXB-BBXI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
CYP15G0101DXB-BBC | Telecom Circuit, 1-Trnsvr, BICMOS, PBGA100, BGA-100 | Cypress Semiconductor | CYP15G0101DXB-BBXI vs CYP15G0101DXB-BBC |
CYP15G0101DXB-BBXC | Interface Circuit, 1-Trnsvr, BICMOS, PBGA100, BGA-100 | Infineon Technologies AG | CYP15G0101DXB-BBXI vs CYP15G0101DXB-BBXC |
CYP15G0101DXB-BBXI | Interface Circuit, 1-Trnsvr, BICMOS, PBGA100, BGA-100 | Cypress Semiconductor | CYP15G0101DXB-BBXI vs CYP15G0101DXB-BBXI |