Part Details for CYV15G0204RB-BGXC by Cypress Semiconductor
Overview of CYV15G0204RB-BGXC by Cypress Semiconductor
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for CYV15G0204RB-BGXC
CYV15G0204RB-BGXC CAD Models
CYV15G0204RB-BGXC Part Data Attributes
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CYV15G0204RB-BGXC
Cypress Semiconductor
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Datasheet
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CYV15G0204RB-BGXC
Cypress Semiconductor
Telecom Circuit, 1-Func, BICMOS, PBGA256, 27 X 27 MM, 1.57 MM HEIGHT, LEAD FREE, TBGA-256
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
Part Package Code | BGA | |
Package Description | 27 X 27 MM, 1.57 MM HEIGHT, LEAD FREE, TBGA-256 | |
Pin Count | 256 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 | |
JESD-30 Code | S-PBGA-B256 | |
JESD-609 Code | e1 | |
Length | 27 mm | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 256 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.745 mm | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | BICMOS | |
Telecom IC Type | TELECOM CIRCUIT | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 20 | |
Width | 27 mm |