There are no models available for this part yet.
Overview of DPS128X32CV3-35I by Twilight Technology Inc
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 4 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Internet of Things (IoT)
Smart Cities
CAD Models for DPS128X32CV3-35I by Twilight Technology Inc
Part Data Attributes for DPS128X32CV3-35I by Twilight Technology Inc
|
|
|
|---|---|
|
Pbfree Code
|
No
|
|
Rohs Code
|
No
|
|
Part Life Cycle Code
|
Active
|
|
Ihs Manufacturer
|
TWILIGHT TECHNOLOGY INC
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|
Part Package Code
|
PGA
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|
Package Description
|
PGA, PGA66,11X11
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|
Pin Count
|
66
|
|
Reach Compliance Code
|
unknown
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|
ECCN Code
|
3A991.B.2.A
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|
HTS Code
|
8542.32.00.41
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|
Access Time-Max
|
35 ns
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Additional Feature
|
USER CONFIGURABLE AS 128K X 32
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I/O Type
|
COMMON
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|
JESD-30 Code
|
S-CPGA-P66
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Length
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30.226 mm
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Memory Density
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4194304 bit
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Memory IC Type
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SRAM MODULE
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Memory Width
|
8
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Number of Functions
|
1
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Number of Terminals
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66
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Number of Words
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524288 words
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Number of Words Code
|
512000
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Operating Mode
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ASYNCHRONOUS
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|
Operating Temperature-Max
|
85 °C
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Operating Temperature-Min
|
-40 °C
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Organization
|
512KX8
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Output Characteristics
|
3-STATE
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Package Body Material
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CERAMIC, METAL-SEALED COFIRED
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Package Code
|
PGA
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Package Equivalence Code
|
PGA66,11X11
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Package Shape
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SQUARE
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Package Style
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GRID ARRAY
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Parallel/Serial
|
PARALLEL
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Peak Reflow Temperature (Cel)
|
NOT SPECIFIED
|
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Qualification Status
|
Not Qualified
|
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Seated Height-Max
|
6.4008 mm
|
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Standby Current-Max
|
0.0016 A
|
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Standby Voltage-Min
|
2 V
|
|
Supply Current-Max
|
0.56 mA
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Supply Voltage-Max (Vsup)
|
5.5 V
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Supply Voltage-Min (Vsup)
|
4.5 V
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|
Supply Voltage-Nom (Vsup)
|
5 V
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Surface Mount
|
NO
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Technology
|
CMOS
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Temperature Grade
|
INDUSTRIAL
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Terminal Form
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PIN/PEG
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Terminal Pitch
|
2.54 mm
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Terminal Position
|
PERPENDICULAR
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Time@Peak Reflow Temperature-Max (s)
|
NOT SPECIFIED
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Width
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30.226 mm
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Alternate Parts for DPS128X32CV3-35I
This table gives cross-reference parts and alternative options found for DPS128X32CV3-35I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of DPS128X32CV3-35I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| DPS128X32CV3-35B | SRAM Module, 512KX8, 35ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.252 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 | B&B Electronics Manufacturing Company | DPS128X32CV3-35I vs DPS128X32CV3-35B |
| DPS128X32CV3-35M | SRAM Module, 512KX8, 35ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.252 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 | B&B Electronics Manufacturing Company | DPS128X32CV3-35I vs DPS128X32CV3-35M |
| DPS128X32CV3-35C | SRAM Module, 512KX8, 35ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.252 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 | Twilight Technology Inc | DPS128X32CV3-35I vs DPS128X32CV3-35C |
| DPS128X32CV3-35C | SRAM Module, 512KX8, 35ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.252 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 | B&B Electronics Manufacturing Company | DPS128X32CV3-35I vs DPS128X32CV3-35C |