Part Details for DS100MB201SQ/NOPB by Texas Instruments
Overview of DS100MB201SQ/NOPB by Texas Instruments
- Distributor Offerings:
- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for DS100MB201SQ/NOPB
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
DS100MB201SQ/NOPB-ND
|
DigiKey | IC DUAL LANE MUX/BUFFER 54WQFN Min Qty: 2000 Lead time: 6 Weeks Container: Tape & Reel (TR) | Temporarily Out of Stock |
|
$10.1821 | Buy Now |
DISTI #
926-DS100MB201SQNOPB
|
Mouser Electronics | Encoders, Decoders, Multiplexers & Demultiplexers 10.3-Gbps dual lane 2:1/1:2 mux/buffer with equalization 54-WQFN -40 to 85 RoHS: Compliant | 0 |
|
$10.1800 | Order Now |
|
Ameya Holding Limited | IC DUAL LANE MUX/BUFFER 54-LLP | 100 |
|
RFQ |
Part Details for DS100MB201SQ/NOPB
DS100MB201SQ/NOPB CAD Models
DS100MB201SQ/NOPB Part Data Attributes
|
DS100MB201SQ/NOPB
Texas Instruments
Buy Now
Datasheet
|
Compare Parts:
DS100MB201SQ/NOPB
Texas Instruments
10.3-Gbps dual lane 2:1/1:2 mux/buffer with equalization 54-WQFN -40 to 85
|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
Part Package Code | QFN | |
Package Description | WQFN-54 | |
Pin Count | 54 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | Texas Instruments | |
Family | 100 | |
JESD-30 Code | R-XQCC-N54 | |
JESD-609 Code | e3 | |
Length | 10 mm | |
Logic IC Type | LOGIC CIRCUIT | |
Moisture Sensitivity Level | 2 | |
Number of Functions | 4 | |
Number of Terminals | 54 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Output Polarity | COMPLEMENTARY | |
Package Body Material | UNSPECIFIED | |
Package Code | HVQCCN | |
Package Shape | RECTANGULAR | |
Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
Packing Method | TR | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 0.8 mm | |
Supply Voltage-Max (Vsup) | 2.625 V | |
Supply Voltage-Min (Vsup) | 2.375 V | |
Supply Voltage-Nom (Vsup) | 2.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | MATTE TIN | |
Terminal Form | NO LEAD | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 5.5 mm |