Part Details for DSPIC33EP512MU810E/BG by Microchip Technology Inc
Overview of DSPIC33EP512MU810E/BG by Microchip Technology Inc
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Part Details for DSPIC33EP512MU810E/BG
DSPIC33EP512MU810E/BG CAD Models
DSPIC33EP512MU810E/BG Part Data Attributes
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DSPIC33EP512MU810E/BG
Microchip Technology Inc
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DSPIC33EP512MU810E/BG
Microchip Technology Inc
16-BIT, FLASH, 60 MHz, MICROCONTROLLER, PBGA121, 10 X 10 MM, 1.10 MM HEIGHT, LEAD FREE, PLASTIC, BGA-121
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
| Part Package Code | BGA | |
| Package Description | 10 X 10 MM, 1.10 MM HEIGHT, LEAD FREE, PLASTIC, BGA-121 | |
| Pin Count | 121 | |
| Reach Compliance Code | unknown | |
| Has ADC | YES | |
| Address Bus Width | 16 | |
| Bit Size | 16 | |
| Clock Frequency-Max | 40 MHz | |
| DAC Channels | NO | |
| DMA Channels | YES | |
| External Data Bus Width | 16 | |
| JESD-30 Code | S-PBGA-B121 | |
| JESD-609 Code | e3 | |
| Length | 10 mm | |
| Number of I/O Lines | 83 | |
| Number of Terminals | 121 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Qualification Status | Not Qualified | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1.2 mm | |
| Speed | 60 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Width | 10 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |