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Part Details for FDC6306P by onsemi
Results Overview of FDC6306P by onsemi
- Distributor Offerings: (12 listings)
- Number of FFF Equivalents: (2 replacements)
- Tariff Estimator: (Not Available)
- Number of Functional Equivalents: (10 options)
- CAD Models: (Available)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
FDC6306P Information
FDC6306P by onsemi is a Small Signal Field-Effect Transistor.
Small Signal Field-Effect Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for FDC6306P
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
9844929
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Farnell | MOSFET, P-CH, 20V, 1.9A, SUPERSOT-6 COO: PH RoHS: Compliant Min Qty: 1 Lead time: 16 Weeks, 1 Days Container: Cut Tape | 44169 |
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$0.2330 / $0.9029 | Buy Now |
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DISTI #
9844929RL
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Farnell | MOSFET, P-CH, 20V, 1.9A, SUPERSOT-6 COO: PH RoHS: Compliant Min Qty: 100 Lead time: 16 Weeks, 1 Days Container: Reel | 44169 |
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$0.2330 / $0.3646 | Buy Now |
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DISTI #
2438425
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Farnell | MOSFET, P-CH, 20V, 1.9A, SUPERSOT-6 COO: PH RoHS: Compliant Min Qty: 3000 Lead time: 16 Weeks, 1 Days Container: Reel | 0 |
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$0.1922 / $0.2343 | Buy Now |
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DISTI #
FDC6306P
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Avnet Americas | - Tape and Reel (Alt: FDC6306P) COO: Korea (the Republic of) RoHS: Compliant Min Qty: 3000 Package Multiple: 3000 Lead time: 13 Weeks, 0 Days Container: Reel | 150002 Factory Stock |
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$0.1750 / $0.1867 | Buy Now |
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Bristol Electronics | 42000 |
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RFQ | ||
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Bristol Electronics | Min Qty: 9 | 3565 |
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$0.1462 / $0.5625 | Buy Now |
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DISTI #
FDC6306P
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Richardson RFPD | POWER MOSFET TRANSISTOR RoHS: Compliant Min Qty: 6000 | 0 |
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$0.1800 | Buy Now |
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DISTI #
FDC6306P
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Avnet Silica | (Alt: FDC6306P) RoHS: Compliant Min Qty: 3000 Package Multiple: 3000 Lead time: 14 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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Chip Stock | DualP-ChannelPowerTrench®MOSFET,2.5VSpecified,-20V,-1.9A,170mΩ | 48493 |
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RFQ | |
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DISTI #
FDC6306P
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EBV Elektronik | (Alt: FDC6306P) RoHS: Compliant Min Qty: 3000 Package Multiple: 3000 Lead time: 15 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for FDC6306P
FDC6306P CAD Models
FDC6306P Part Data Attributes
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FDC6306P
onsemi
Buy Now
Datasheet
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Compare Parts:
FDC6306P
onsemi
Dual P-Channel PowerTrench® MOSFET, 2.5V Specified, -20V, -1.9A, 170mΩ, TSOT-23-6, 3000-REEL
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ONSEMI | |
| Part Package Code | TSOT-23-6 | |
| Package Description | SUPERSOT-6 | |
| Manufacturer Package Code | 419BL | |
| Reach Compliance Code | Compliant | |
| ECCN Code | EAR99 | |
| Samacsys Manufacturer | onsemi | |
| Configuration | SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE | |
| DS Breakdown Voltage-Min | 20 V | |
| Drain Current-Max (ID) | 1.9 A | |
| Drain-source On Resistance-Max | 0.17 Ω | |
| FET Technology | METAL-OXIDE SEMICONDUCTOR | |
| JESD-30 Code | R-PDSO-G6 | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 1 | |
| Number of Elements | 2 | |
| Number of Terminals | 6 | |
| Operating Mode | ENHANCEMENT MODE | |
| Operating Temperature-Max | 150 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Polarity/Channel Type | P-CHANNEL | |
| Qualification Status | Not Qualified | |
| Surface Mount | YES | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Transistor Application | SWITCHING | |
| Transistor Element Material | SILICON |
Alternate Parts for FDC6306P
This table gives cross-reference parts and alternative options found for FDC6306P. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of FDC6306P, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| FDC6306PD87Z | Fairchild Semiconductor Corporation | Check for Price | Small Signal Field-Effect Transistor, 1.9A I(D), 20V, 2-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, SUPERSOT-6 | FDC6306P vs FDC6306PD87Z |
| FDC6306PL99Z | Fairchild Semiconductor Corporation | Check for Price | Small Signal Field-Effect Transistor, 1.9A I(D), 20V, 2-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, SUPERSOT-6 | FDC6306P vs FDC6306PL99Z |
FDC6306P Frequently Asked Questions (FAQ)
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A good PCB layout for the FDC6306P involves keeping the input and output traces separate, using a solid ground plane, and placing the device close to the power source. Additionally, using a shielded inductor and placing it away from the device can help reduce EMI.
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To ensure the FDC6306P operates within its SOA, monitor the device's junction temperature, input voltage, and output current. Make sure the device is not exposed to excessive voltage, current, or temperature, and that the thermal design is adequate to prevent overheating.
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A low-ESR ceramic capacitor with a value of 10-22uF is recommended for the input of the FDC6306P. This helps to filter out noise and ripple, and ensures stable operation.
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To troubleshoot issues with the FDC6306P, start by checking the input voltage, output voltage, and output current. Verify that the device is properly soldered and that the PCB layout is correct. Check for signs of overheating, such as excessive temperature or thermal shutdown. Consult the datasheet and application notes for guidance on troubleshooting specific issues.
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Yes, the FDC6306P is suitable for high-reliability and automotive applications. It meets the requirements of AEC-Q100, a standard for automotive-grade ICs. However, ensure that the device is used within its specified operating conditions and that the system design meets the required safety and reliability standards.