Part Details for FXLC95000CLR1 by NXP Semiconductors
Overview of FXLC95000CLR1 by NXP Semiconductors
- Distributor Offerings:
- Number of FFF Equivalents:
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- Number of Functional Equivalents:
- Part Data Attributes
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Applications
Computing and Data Storage
Financial Technology (Fintech)
Electronic Manufacturing
Automotive
Price & Stock for FXLC95000CLR1
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
FXLC95000CLR1CT-ND
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DigiKey | ACCEL 2-8G I2C/SPI 24LLPEP Min Qty: 1 Lead time: 20 Weeks Container: Cut Tape (CT), Tape & Reel (TR) |
1 In Stock |
|
$6.1200 | Buy Now |
|
DISTI #
2832-FXLC95000CLR1TR-ND
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DigiKey | ACCEL 2-8G I2C/SPI 24LLPEP Min Qty: 1 Lead time: 20 Weeks Container: Tape & Reel (TR) MARKETPLACE PRODUCT | Limited Supply - Call |
|
Buy Now | |
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Rochester Electronics | FXLC95000CL - Intelligent Motion-Sensing Platform, 128K Flash RoHS: Compliant Status: Obsolete Min Qty: 1 | 14 |
|
$3.3100 / $3.8900 | Buy Now |
|
DISTI #
FXLC95000CLR1
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Avnet Americas | Motion-Sensing Accelerometer Analog/Digital 24-Pin LGA T/R - Tape and Reel (Alt: FXLC95000CLR1) RoHS: Compliant Min Qty: 206 Package Multiple: 1 Lead time: 0 Weeks, 2 Days Container: Reel | 42000 Partner Stock |
|
$3.0132 / $3.4749 | Buy Now |
|
DISTI #
FXLC95000CLR1
|
Avnet Americas | Motion-Sensing Accelerometer Analog/Digital 24-Pin LGA T/R - Tape and Reel (Alt: FXLC95000CLR1) RoHS: Compliant Min Qty: 206 Package Multiple: 1 Lead time: 0 Weeks, 2 Days Container: Reel | 42000 Partner Stock |
|
$3.0132 / $3.4749 | Buy Now |
|
DISTI #
2377752
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Farnell | MOTION-SENSING PLATFORM, 3-AXIS, LGA-24 RoHS: Compliant Min Qty: 1000 Lead time: 52 Weeks, 1 Days Container: Each | 0 |
|
$4.0857 | Buy Now |
Part Details for FXLC95000CLR1
FXLC95000CLR1 CAD Models
FXLC95000CLR1 Part Data Attributes
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FXLC95000CLR1
NXP Semiconductors
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FXLC95000CLR1
NXP Semiconductors
SPECIALTY MICROPROCESSOR CIRCUIT, PBGA24
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | 3 X 5 MM, 1 MM HEIGHT, LGA-24 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 2 Days | |
| Samacsys Manufacturer | NXP | |
| JESD-30 Code | R-PBGA-B24 | |
| Length | 5 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 24 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFLGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 1.1 mm | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| Supply Voltage-Nom | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BUTT | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 3 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |