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Price & Stock for: GRM155R71H102KA01D

Distributor Stock MOQ Package QTY Break / Prices
View this part on Avnet Americas 30,000 10,000 Reel
  • 10,000 $0.0022
View this part on Avnet Americas 0 1 Ammo Pack
  • 1 $0.1000
  • 25 $0.0190
  • 100 $0.0090
  • 250 $0.0080
  • 500 $0.0070
  • 1,000 $0.0050
View this part on Newark 0 30,000 TAPE & REEL FULL
  • 30,000 $0.0040
View this part on Newark 47,733 1 TAPE & REEL CUT
  • 1 $0.0040
  • 25 $0.0040
  • 100 $0.0040
  • 250 $0.0040
  • 500 $0.0040
  • 1,000 $0.0040
View this part on Bisco Industries 5 1

Purchasing Insights: GRM155R71H102KA01D

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Risk Rank

Risk Rank is a proprietary algorithm Supplyframe has developed to quantify component risk rank using multiple data points. This ranking helps engineers and buyers determine whether alternates should be sought for parts that are deemed as high risk.

Risk Rank Example

Risk Rank is determined by a combination of factors such as product lifecycle status, price & inventory votality, current inventory availability, and much more. Even the availability of manufacturer specifications and part documentation, such as datasheets and reference designs, have an impact on determining the overall riskiness of a part.

The risk is characterized across three product phases:

  • Design
  • Production
  • Long Term

For Purchasing Risk Rank, we focus on the Production and the Long Term Phases on Findchips in our evaluation of Risk.

Production Phase

The production phase is when the product is being assembled. Sourcing parts reliably is the essential task during this phase, as it determines whether the product can continue production. During the production phase, there is no time to test new components if something goes awry – the design is the locked-in and a primary risk factor is the component availability in the marketplace. It is possible to utilize alternative parts if things go wrong during this phase, but they need to be FFF (form, fit, function) compatible. Therefore, if a part is available in the online marketplace and has available FFF components, it will be listed as lower risk.

Long Term Phase

The amount of time that a product is manufactured often depends on the industry. Some automobile electronics are made consistently for 5-10 years, whereas military and industrial electronics could be produced from anywhere from 30-50 years.

This means part risk goes up with the likelihood of obsolescence. If a chip manufacturer decides to stop making a particular chip, it is supremely disruptive to mature products, because there may not even be replacement parts available. Other factors like environmental certifications (RoHS) feed into this as well, as non-certified parts are more likely to become obsolete in the future.

We combine both of these aspects into a Purchasing Risk Rank score in order to focus in on risk elements that would be most pertinent for purchasers to be aware of.

Risk Rank Breakdown

Risk Rank: Purchasing Risk

What is purchasing risk rank?

Purchasing Risk Rank is determined by in-depth analysis across risk factors of production risk and long term risk of a given part.

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Part Details for: GRM155R71H102KA01D

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Risk Rank

Risk Rank is a proprietary algorithm Supplyframe has developed to quantify component risk rank using multiple data points. This ranking helps engineers and buyers determine whether alternates should be sought for parts that are deemed as high risk.

Risk Rank Example

Risk Rank is determined by a combination of factors such as product lifecycle status, price, inventory votality, current inventory availability, and much more. Even the availability of manufacturer specifications and part documentation, such as datasheets and reference designs, have an impact on determining the overall riskiness of a part.

The risk is characterized across three product phases:

  • Design
  • Production
  • Long Term

We focus on the Design Phase on Findchips in our evaluation of Risk.

Design Phase

The design phase of a product is the beginning of the product lifecycle. This is when engineers are doing analysis of components in the marketplace, determining which specifications are most important for their design and assessing the cost impact of using this particular component. While this is early in the product lifecycle, choices at this point can severely impact a product much later on when the product is being made. Additionally, this stage is the one furthest from a product being made, which is why we focus on metrics of stability over time when determining Design Risk.

Risk Rank Breakdown

Risk Rank: Design Risk

What is design risk rank?

Design Risk Rank is determined by in-depth analysis across risk factors, including part availability, functional equivalents, lifecycle, and more.

Alternate Parts for: GRM155R71H102KA01D

Part Number Description Manufacturer Compare
MCH155CN102KK Capacitors Ceramic Capacitor, Multilayer, Ceramic, 50V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.001uF, Surface Mount, 0402, CHIP ROHM Semiconductor GRM155R71H102KA01D vs MCH155CN102KK
CM05X7R102K50AL Capacitors Ceramic Capacitor, Multilayer, Ceramic, 50V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.001uF, Surface Mount, 0402, CHIP, ROHS COMPLIANT KYOCERA Corporation GRM155R71H102KA01D vs CM05X7R102K50AL
GRP155R71H102KD01E Capacitors Ceramic Capacitor, Multilayer, Ceramic, 50V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.001uF, Surface Mount, 0402, CHIP Murata Manufacturing Co Ltd GRM155R71H102KA01D vs GRP155R71H102KD01E
0402B102K500N Capacitors Ceramic Capacitor, Multilayer, Ceramic, 50V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.001uF, Surface Mount, 0402, CHIP Fenghua (HK) Electronics Ltd GRM155R71H102KA01D vs 0402B102K500N
MCH155CN102KC Capacitors Ceramic Capacitor, Multilayer, Ceramic, 50V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.001uF, Surface Mount, 0402, CHIP ROHM Semiconductor GRM155R71H102KA01D vs MCH155CN102KC
0402B102K500CB Capacitors Ceramic Capacitor, Multilayer, Ceramic, 50V, 10% +Tol, 10% -Tol, X7R, -/+15ppm/Cel TC, 0.001uF, 0402, AAC Components Inc GRM155R71H102KA01D vs 0402B102K500CB
MCH155CN102KL Capacitors Ceramic Capacitor, Multilayer, Ceramic, 50V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.001uF, Surface Mount, 0402, CHIP ROHM Semiconductor GRM155R71H102KA01D vs MCH155CN102KL
0402B102K500NB Capacitors Ceramic Capacitor, Multilayer, Ceramic, 50V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.001uF, Surface Mount, 0402, CHIP Fenghua (HK) Electronics Ltd GRM155R71H102KA01D vs 0402B102K500NB
0402B102K500NT Capacitors Ceramic Capacitor, Multilayer, Ceramic, 50V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.001uF, Surface Mount, 0402, CHIP Fenghua (HK) Electronics Ltd GRM155R71H102KA01D vs 0402B102K500NT
0402B102K500ST Capacitors Ceramic Capacitor, Multilayer, Ceramic, 50V, 10% +Tol, 10% -Tol, X7R, -/+15ppm/Cel TC, 0.001uF, 0402, Knowles Capacitors GRM155R71H102KA01D vs 0402B102K500ST

Resources and Additional Insights

Reference Designs

  • Reference Design Realizing Output Current Sensing and Limit, Plug-in Detection in Power Bank
    PMP9776: A power bank is a portable device that can supply USB power using stored energy in its built-in batteries. This reference design demonstrates a circuit based on the TPS61236 for the USB output port of the power-bank. The reference design features a 5V and 2.4A output capability, auto detection of a portable device plug-in, output current sensing and limiting, short circuit protection, temperature protection, and battery voltage indication.
  • CC2538EM Reference Design
    CC2538EM-RD: This 2.4 GHz RF Layout Reference Design demonstrates good decoupling and layout techniques for a low power RF device operating in the license free 2.4 GHz frequency band.
  • Automotive 60W Brushless DC (BLDC) Motor Drive
    TIDA-00143: This TIDA-00143 reference design is a BLDC motor controller and is designed to operate from a single 12V (nominal) power supply which can vary over a wide range of voltages as found in typical automotive applications. The board is designed to drive motors in the 60W range, which require currents of 5 Amps. The size and layout of the board is intended to facilitate evaluation of the drive electronics and firmware, with easy access to key signals on individual test points. Connection to a wide variety of motors is possible using either the 3-contact connector or by soldering motor phase wires to plated-through holes in the board. The 12Vdc power is fused to prevent damage to the board or to bench power supplies in case of a motor fault during testing. Command and status of the motor can be communicated through the standard JTAG connector, or through PWM input and output signals. Users can also re-program the microcontroller through the JTAG connector, allowing customization to a wide variety of applications.
  • Wide Bandwidth Optical Front-end Reference Design
    TIDA-00725: This reference design implements and measures a complete 120MHz wide bandwidth optical front end comprising a high speed transimpedance amplifier, fully differential amplifier, and high speed 14-bit 160MSPS ADC with JESD204B interface. Hardware and software are provided to evaluate the performance of the system in response to high speed optical pulses generated from the included laser driver and diode for applications including optical time domain reflectrometry (OTDR).
  • 85-265VAC Input, 13.5V/0.9A PSR Flyback Reference Design
    PMP11135: The PMP11135 reference design uses the UCC28711 to provide an isolated 13.5V at 0.9A output. The UCC28711 implements primary-side regulation, eliminating the need for an opto-coupler and reducing the size and cost of the design. This design meets Class B conducted emissions without the need for a common mode input choke.
  • Xilinx Virtex Ultrascale FPGA Multi-Gigabit Transceiver (MGT) Power Reference Design with PMBus
    PMP9408: The PMP9408 reference design provides all the power supply rails necessary to power the multi-gigabit transcievers (MGT) in Xilinx's Virtex® Ultrascale™ FPGAs. It utilizes a PMBus interface for current and voltage monitoring and meets Xilinx's low output voltage ripple requirement. This design uses a 5V input and offers a low cost discrete solution.
  • High efficiency scalable 3-phase 1V/90A PMBus power supply for ASIC core rails
    PMP10962: The PMP10962 reference design is a 3-phase PMBus converter for high current ASIC core rail regulation. It employs DCAP+ control for fast transient response and TI's proprietary AutoBalance for tight steady and dynamic phase-to-phase current balance. It drives three TI NexFET smart power stages for high power density and efficiency. It easily scales-up/scales-down to meet a wide load range. PMBus capability and on-board NVM enable easy design, configuration, and customization, with telemetry of output voltage, current, temperature, and power.
  • Schematic and Layout Recommendations for the Giga Sample Per Second (GSPS) ADC
    TIDA-00071: This reference design is a guide to the schematics and layout for the system designer using a GSPS ADC in their system. Use this reference design along with the datasheet — the datasheet is always the final authority. Also, the ADC1xDxxxx(RF)RB Reference Board provides a useful reference design. All design source files for the Reference Board as well as the CAD/CAE symbols for the ADC are available on the product web page or TI-Designs for download. For the purpose of this document, ADC or GSPS ADC refers to the ADC12D1800RF, ADC12D1600RF, ADC12D1000RF, ADC12D800RF, ADC12D500RF, ADC12D1800, ADC12D1600, ADC12D1000, ADC10D1500, ADC10D1000, ADC12D1600QML, and ADC10D1000QML.
  • Power Reference Design for Xilinx Ultrascale Kintex FPGA Multi-Gigabit Transciever (MGT) with PMBus
    PMP9463: The PMP9463 reference design provides all the power supply rails necessary to power the multi-gigabit transcievers (MGT) in Xilinx's Ultrascale™ Kintex® FPGAs. It utilizes a PMBus interface for current and voltage monitoring and meets Xilinx's low output voltage ripple requirement. This design uses a 5V input and offers a low cost discrete solution.
  • 12Vin 1V 50A TPS40422 & Power Block II CSD87384 2 Phases w/PMBus Interface Reference Design
    PMP8999: It is a two phase Synchronous Buck converter to provide high current with low ripple and fast dynamic response for high speed processor core applications. Same approach can also be used to power Memory and Input / Output power voltages, typically 1.2V to 3.3V. The two phase interleave reduces output ripple and allows faster response to rapidly changing loads. The two phases distribute power loss to eliminate need for added heat sink hardware. The "Project File" for the TPS40422 to communicate with TI's Fusion GUI is included. Output voltage and current limit can be adjusted and monitored thru the GUI. Additional settings can be accessed thru the same GUI. Test Report includes thermal images to show load capability, both with and without fan cooling. Testing done at 12Vin, where voltage stresses, losses and output ripple greatest. Design will work also at 5Vin with same high speed control loop, due to Input Voltage Feed Forward in the TPS40422.
  • Portable ZigBee Plug-In Software Framework for any OS
    TIDC-ZNP-HOST-SW3: A portable host software framework that allows ZigBee to be “bolted on” to existing products in the market, quickly enabling Internet of Things (IoT) system applications. This design can be used with any microcontrollers or processors, offering flexibility in the solution. This software framework design allows easy integration of applications on any operating system. Combined with the richness of intuitive application examples and a complete and simple API set, it allows easy integration as well as fast prototyping and product development.

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