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GRM55DR72E105KW01L by:
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Price & Stock for: GRM55DR72E105KW01L

Distributor Stock MOQ Package QTY Break / Prices
View this part on Avnet Americas 0 1,000 Reel
  • 1,000 $0.3266
  • 2,000 $0.4792
  • 4,000 $0.4684
  • 6,000 $0.4576
  • 8,000 $0.4468
  • 10,000 $0.4396
  • 100,000 $0.4324
View this part on Newark 0 1,000 TAPE & REEL FULL
  • 1,000 $0.6290
  • 2,000 $0.5370
  • 4,000 $0.4450
View this part on Newark 0 1 TAPE & REEL CUT
  • 1 $1.2700
  • 10 $0.8020
  • 25 $0.7890
  • 50 $0.7750
  • 100 $0.7620
View this part on Bristol Electronics 2,319 1
View this part on Bristol Electronics 348 4
  • 4 $1.5000
  • 15 $0.9750
  • 53 $0.5625
  • 179 $0.4800

Purchasing Insights: GRM55DR72E105KW01L

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Risk Rank

Risk Rank is a proprietary algorithm Supplyframe has developed to quantify component risk rank using multiple data points. This ranking helps engineers and buyers determine whether alternates should be sought for parts that are deemed as high risk.

Risk Rank Example

Risk Rank is determined by a combination of factors such as product lifecycle status, price & inventory votality, current inventory availability, and much more. Even the availability of manufacturer specifications and part documentation, such as datasheets and reference designs, have an impact on determining the overall riskiness of a part.

The risk is characterized across three product phases:

  • Design
  • Production
  • Long Term

For Purchasing Risk Rank, we focus on the Production and the Long Term Phases on Findchips in our evaluation of Risk.

Production Phase

The production phase is when the product is being assembled. Sourcing parts reliably is the essential task during this phase, as it determines whether the product can continue production. During the production phase, there is no time to test new components if something goes awry – the design is the locked-in and a primary risk factor is the component availability in the marketplace. It is possible to utilize alternative parts if things go wrong during this phase, but they need to be FFF (form, fit, function) compatible. Therefore, if a part is available in the online marketplace and has available FFF components, it will be listed as lower risk.

Long Term Phase

The amount of time that a product is manufactured often depends on the industry. Some automobile electronics are made consistently for 5-10 years, whereas military and industrial electronics could be produced from anywhere from 30-50 years.

This means part risk goes up with the likelihood of obsolescence. If a chip manufacturer decides to stop making a particular chip, it is supremely disruptive to mature products, because there may not even be replacement parts available. Other factors like environmental certifications (RoHS) feed into this as well, as non-certified parts are more likely to become obsolete in the future.

We combine both of these aspects into a Purchasing Risk Rank score in order to focus in on risk elements that would be most pertinent for purchasers to be aware of.

Risk Rank Breakdown

Risk Rank: Purchasing Risk

What is purchasing risk rank?

Purchasing Risk Rank is determined by in-depth analysis across risk factors of production risk and long term risk of a given part.

Market Price Analysis

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Part Details for: GRM55DR72E105KW01L

CAD Models

Risk Rank

Risk Rank is a proprietary algorithm Supplyframe has developed to quantify component risk rank using multiple data points. This ranking helps engineers and buyers determine whether alternates should be sought for parts that are deemed as high risk.

Risk Rank Example

Risk Rank is determined by a combination of factors such as product lifecycle status, price, inventory votality, current inventory availability, and much more. Even the availability of manufacturer specifications and part documentation, such as datasheets and reference designs, have an impact on determining the overall riskiness of a part.

The risk is characterized across three product phases:

  • Design
  • Production
  • Long Term

We focus on the Design Phase on Findchips in our evaluation of Risk.

Design Phase

The design phase of a product is the beginning of the product lifecycle. This is when engineers are doing analysis of components in the marketplace, determining which specifications are most important for their design and assessing the cost impact of using this particular component. While this is early in the product lifecycle, choices at this point can severely impact a product much later on when the product is being made. Additionally, this stage is the one furthest from a product being made, which is why we focus on metrics of stability over time when determining Design Risk.

Risk Rank Breakdown

Risk Rank: Design Risk

What is design risk rank?

Design Risk Rank is determined by in-depth analysis across risk factors, including part availability, functional equivalents, lifecycle, and more.

Alternate Parts for: GRM55DR72E105KW01L

Part Number Description Manufacturer Compare
2220PC105KAT1A Capacitors Ceramic Capacitor, Multilayer, Ceramic, 250V, 10% +Tol, 10% -Tol, X7R, 15% TC, 1uF, Surface Mount, 2220, CHIP, ROHS COMPLIANT Kyocera AVX Components GRM55DR72E105KW01L vs 2220PC105KAT1A
2220PC105KAZ1A Capacitors Ceramic Capacitor, Multilayer, Ceramic, 250V, 10% +Tol, 10% -Tol, X7R, 15% TC, 1uF, Surface Mount, 2220, CHIP, ROHS COMPLIANT Kyocera AVX Components GRM55DR72E105KW01L vs 2220PC105KAZ1A
LD20PC105KAB9A Capacitors Ceramic Capacitor, Multilayer, Ceramic, 250V, 10% +Tol, 10% -Tol, X7R, 15% TC, 1uF, Surface Mount, 2220, CHIP Kyocera AVX Components GRM55DR72E105KW01L vs LD20PC105KAB9A
2220PC105KAT3A Capacitors Ceramic Capacitor, Multilayer, Ceramic, 250V, 10% +Tol, 10% -Tol, X7R, 15% TC, 1uF, Surface Mount, 2220, CHIP, ROHS COMPLIANT Kyocera AVX Components GRM55DR72E105KW01L vs 2220PC105KAT3A
2220PC105KAZ3A Capacitors Ceramic Capacitor, Multilayer, Ceramic, 250V, 10% +Tol, 10% -Tol, X7R, 15% TC, 1uF, Surface Mount, 2220, CHIP, ROHS COMPLIANT Kyocera AVX Components GRM55DR72E105KW01L vs 2220PC105KAZ3A
LD20PC105KAX1A Capacitors Ceramic Capacitor, Multilayer, Ceramic, 250V, 10% +Tol, 10% -Tol, X7R, 15% TC, 1uF, Surface Mount, 2220, CHIP Kyocera AVX Components GRM55DR72E105KW01L vs LD20PC105KAX1A
LD20PC105KAX3A Capacitors Ceramic Capacitor, Multilayer, Ceramic, 250V, 10% +Tol, 10% -Tol, X7R, 15% TC, 1uF, Surface Mount, 2220, CHIP Kyocera AVX Components GRM55DR72E105KW01L vs LD20PC105KAX3A
2220PC105KAT9A Capacitors Ceramic Capacitor, Multilayer, Ceramic, 250V, 10% +Tol, 10% -Tol, X7R, 15% TC, 1uF, Surface Mount, 2220, CHIP, ROHS COMPLIANT Kyocera AVX Components GRM55DR72E105KW01L vs 2220PC105KAT9A
LD20PC105KAB3A Capacitors Ceramic Capacitor, Multilayer, Ceramic, 250V, 10% +Tol, 10% -Tol, X7R, 15% TC, 1uF, Surface Mount, 2220, CHIP Kyocera AVX Components GRM55DR72E105KW01L vs LD20PC105KAB3A
LD20PC105KAX9A Capacitors Ceramic Capacitor, Multilayer, Ceramic, 250V, 10% +Tol, 10% -Tol, X7R, 15% TC, 1uF, Surface Mount, 2220, CHIP Kyocera AVX Components GRM55DR72E105KW01L vs LD20PC105KAX9A

Resources and Additional Insights

Reference Designs

  • Piezo Speaker Strobe Notification Reference Design
    TIDA-00376: TIDA-00376 uses Texas Instrument’s industrial piezo driver, flash LED driver, and the ultra-low-power FRAM microcontroller (MCU) to demonstrate the implementation of both audible and visual notification subsystems, primarily intended for fire alert end-equipment systems. The TI Design demonstrates multiple alert tone frequency outputs through a single piezo transducer, as well as a low input current, high light output LED strobe.
  • 110-VAC to 5-VDC @ 30-mA Non-Isolated Power Supply Reference Design
    TIDA-00379: The 110-VAC to 5-VDC @ 30-mA Non-Isolated Power Supply TI Design uses a low-power, low-cost, off-line buck converter and a low-noise, low-dropout voltage regulator to generate a non-isolated 5V/30mA output directly from a 110-VAC line input with under 10-mV outpur ripple across no-load and full-load conditions. Off-line converters are powered directly from the AC line by using a rectifier and capacitive filter, and do not require a large 60-Hz transformer, thereby eliminating the heaviest and costliest component of a typical transformer-based power supply. The entire TI design is implemented on a single-sided, double-layer board size of just 63.2 x 38.1 mm with a build-of-materials (BOM) count of 20 devices.

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