Part Details for GS882Z18CD-250IV by GSI Technology
Overview of GS882Z18CD-250IV by GSI Technology
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (4 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (4 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Price & Stock for GS882Z18CD-250IV
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
GS882Z18CD-250IV
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Avnet Americas | SRAM Chip Sync Dual 1.8V/2.5V 9M-Bit 512K x 18 5.5ns/3ns 165-Pin FBGA Tray - Trays (Alt: GS882Z18CD-250IV) RoHS: Not Compliant Min Qty: 144 Package Multiple: 144 Lead time: 24 Weeks, 0 Days Container: Tray | 0 |
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$26.2908 / $32.3730 | Buy Now |
DISTI #
464-GS882Z18CD-250IV
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Mouser Electronics | SRAM 1.8/2.5V 512K x 18 9M | 0 |
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$26.5100 / $30.9600 | Order Now |
Part Details for GS882Z18CD-250IV
GS882Z18CD-250IV CAD Models
GS882Z18CD-250IV Part Data Attributes
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GS882Z18CD-250IV
GSI Technology
Buy Now
Datasheet
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Compare Parts:
GS882Z18CD-250IV
GSI Technology
ZBT SRAM, 512KX18, 5.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | GSI TECHNOLOGY | |
Part Package Code | BGA | |
Package Description | LBGA, | |
Pin Count | 165 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.B.2.B | |
HTS Code | 8542.32.00.41 | |
Factory Lead Time | 24 Weeks | |
Access Time-Max | 5.5 ns | |
Additional Feature | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | |
JESD-30 Code | R-PBGA-B165 | |
JESD-609 Code | e0 | |
Length | 15 mm | |
Memory Density | 9437184 bit | |
Memory IC Type | ZBT SRAM | |
Memory Width | 18 | |
Number of Functions | 1 | |
Number of Terminals | 165 | |
Number of Words | 524288 words | |
Number of Words Code | 512000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 512KX18 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.4 mm | |
Supply Voltage-Max (Vsup) | 2 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 13 mm |
Alternate Parts for GS882Z18CD-250IV
This table gives cross-reference parts and alternative options found for GS882Z18CD-250IV. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS882Z18CD-250IV, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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GS882Z18CD-250IVT | ZBT SRAM, 512KX18, 5.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | GS882Z18CD-250IV vs GS882Z18CD-250IVT |
GS882Z18CGD-250IV | ZBT SRAM, 512KX18, 5.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS882Z18CD-250IV vs GS882Z18CGD-250IV |
GS882Z18CD-250VT | ZBT SRAM, 512KX18, 5.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | GS882Z18CD-250IV vs GS882Z18CD-250VT |
GS882Z18CGD-250V | ZBT SRAM, 512KX18, 5.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS882Z18CD-250IV vs GS882Z18CGD-250V |