Part Details for HCS365TI/SM by Microchip Technology Inc
Overview of HCS365TI/SM by Microchip Technology Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (2 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (7 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for HCS365TI/SM
HCS365TI/SM CAD Models
HCS365TI/SM Part Data Attributes:
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HCS365TI/SM
Microchip Technology Inc
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Datasheet
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HCS365TI/SM
Microchip Technology Inc
TELECOM, DATA ENCRYPTION CIRCUIT, PDSO8, 0.208 INCH, PLASTIC, SOIC-8
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
Part Package Code | SOIC | |
Package Description | 0.208 INCH, PLASTIC, SOIC-8 | |
Pin Count | 8 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
JESD-30 Code | R-PDSO-G8 | |
JESD-609 Code | e3 | |
Length | 5.28 mm | |
Moisture Sensitivity Level | 1 | |
Number of Functions | 1 | |
Number of Terminals | 8 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | SOP | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2.03 mm | |
Supply Current-Max | 5 mA | |
Supply Voltage-Nom | 5 V | |
Surface Mount | YES | |
Telecom IC Type | DATA ENCRYPTION CIRCUIT | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | MATTE TIN | |
Terminal Form | GULL WING | |
Terminal Pitch | 1.27 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 5.21 mm |
Alternate Parts for HCS365TI/SM
This table gives cross-reference parts and alternative options found for HCS365TI/SM. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HCS365TI/SM, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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HCS365I/SM | TELECOM, DATA ENCRYPTION CIRCUIT, PDSO8, 0.208 INCH, PLASTIC, SOIC-8 | Microchip Technology Inc | HCS365TI/SM vs HCS365I/SM |
HCS365-/SM | TELECOM, DATA ENCRYPTION CIRCUIT, PDSO8, 0.208 INCH, PLASTIC, SOIC-8 | Microchip Technology Inc | HCS365TI/SM vs HCS365-/SM |