Part Details for HD6412320VF25V by Renesas Electronics Corporation
Overview of HD6412320VF25V by Renesas Electronics Corporation
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for HD6412320VF25V
HD6412320VF25V CAD Models
HD6412320VF25V Part Data Attributes
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HD6412320VF25V
Renesas Electronics Corporation
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HD6412320VF25V
Renesas Electronics Corporation
MCU 16-Bit/32-Bit H8S CISC ROMLess 3.3V 128-Pin PQFP
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Rohs Code | Yes | |
Part Life Cycle Code | Not Recommended | |
Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
Package Description | FQFP-128 | |
Reach Compliance Code | compliant | |
Has ADC | YES | |
Address Bus Width | ||
Bit Size | 16 | |
DAC Channels | YES | |
DMA Channels | YES | |
External Data Bus Width | ||
JESD-30 Code | R-PQFP-G128 | |
JESD-609 Code | e6 | |
Length | 20 mm | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 128 | |
Operating Temperature-Max | 75 °C | |
Operating Temperature-Min | -20 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FQFP | |
Package Shape | RECTANGULAR | |
Package Style | FLATPACK, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 3.15 mm | |
Speed | 25 MHz | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL EXTENDED | |
Terminal Finish | TIN BISMUTH | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | 20 | |
Width | 14 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |