Part Details for HEF4011BPN by Philips Semiconductors
Overview of HEF4011BPN by Philips Semiconductors
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- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Financial Technology (Fintech)
Healthcare
Part Details for HEF4011BPN
HEF4011BPN CAD Models
HEF4011BPN Part Data Attributes
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HEF4011BPN
Philips Semiconductors
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Datasheet
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HEF4011BPN
Philips Semiconductors
NAND Gate, CMOS, PDIP14,
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Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | PHILIPS SEMICONDUCTORS | |
Package Description | DIP, DIP14,.3 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 | |
JESD-30 Code | R-PDIP-T14 | |
JESD-609 Code | e4 | |
Load Capacitance (CL) | 50 pF | |
Logic IC Type | NAND GATE | |
Max I(ol) | 0.00035999999999999997 A | |
Number of Terminals | 14 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | DIP | |
Package Equivalence Code | DIP14,.3 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Prop. Delay@Nom-Sup | 110 ns | |
Qualification Status | Not Qualified | |
Schmitt Trigger | NO | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL |