Part Details for HIP2103FRTAAZ-T by Renesas Electronics Corporation
Results Overview of HIP2103FRTAAZ-T by Renesas Electronics Corporation
- Distributor Offerings: (6 listings)
- Number of FFF Equivalents: (0 replacements)
- Tariff Estimator: (Available) NEW
- Number of Functional Equivalents: (3 options)
- CAD Models: (Available)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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HIP2103FRTAAZ-T Information
HIP2103FRTAAZ-T by Renesas Electronics Corporation is an MOSFET Driver.
MOSFET Drivers are under the broader part category of Drivers And Interfaces.
A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.
Price & Stock for HIP2103FRTAAZ-T
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
27X7174
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Newark | Half Bridge Driver, 3 Phase Dc Brushless, Tdfn8, Full Reel, Ic Type:Half-Bridge Motor Driver, Motor Type:Three Phase Brushless Dc, No. Of Outputs:1Outputs, Output Current:75Ma, Output Voltage:-, Ic Case/Package:Tdfn Rohs Compliant: Yes |Renesas HIP2103FRTAAZ-T RoHS: Compliant Min Qty: 6000 Package Multiple: 1 Date Code: 0 Container: Reel | 0 |
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Buy Now | |
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DISTI #
HIP2103FRTAAZ-T
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Avnet Americas | - Tape and Reel (Alt: HIP2103FRTAAZ-T) COO: Taiwan (Province of China) RoHS: Compliant Min Qty: 6000 Package Multiple: 6000 Lead time: 18 Weeks, 0 Days Container: Reel | 0 |
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$1.1757 / $1.2429 | Buy Now |
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DISTI #
HIP2103FRTAAZ-T
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Avnet Silica | (Alt: HIP2103FRTAAZ-T) RoHS: Compliant Min Qty: 6000 Package Multiple: 6000 Lead time: 20 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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Chip Stock | HalfBridgeMOSFET1A4.5V~14V1ADFN-8-EP(3x3)GateDriveICsROHS | 80000 |
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RFQ | |
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Vyrian | Interface ICs | 305 |
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RFQ | |
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Win Source Electronics | IC GATE DRVR HALF-BRIDGE 8TDFN | 67500 |
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$1.3548 / $2.0323 | Buy Now |
US Tariff Estimator: HIP2103FRTAAZ-T by Renesas Electronics Corporation
Calculations from this tool are estimations only for imports into the United States. Please refer to the distributor or manufacturer and reference official US government sources and authorities to verify any final purchase costs.
Part Details for HIP2103FRTAAZ-T
HIP2103FRTAAZ-T CAD Models
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HIP2103FRTAAZ-T Part Data Attributes
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HIP2103FRTAAZ-T
Renesas Electronics Corporation
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Datasheet
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HIP2103FRTAAZ-T
Renesas Electronics Corporation
60V, 1A/2A Peak, Half Bridge Driver with 4V UVLO, TDFN, /Reel
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
| Part Package Code | TDFN | |
| Package Description | HVSON, SOLCC8,.12,25 | |
| Pin Count | 8 | |
| Manufacturer Package Code | L8.3X3A | |
| Reach Compliance Code | Compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 18 Weeks | |
| Samacsys Manufacturer | Renesas Electronics | |
| High Side Driver | YES | |
| Input Characteristics | SCHMITT TRIGGER | |
| Interface IC Type | HALF BRIDGE BASED MOSFET DRIVER | |
| JESD-30 Code | S-PDSO-N8 | |
| JESD-609 Code | e3 | |
| Length | 3 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 8 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Output Characteristics | STANDARD | |
| Output Peak Current Limit-Nom | 1 A | |
| Output Polarity | TRUE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HVSON | |
| Package Equivalence Code | SOLCC8,.12,25 | |
| Package Shape | SQUARE | |
| Package Style | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 0.8 mm | |
| Supply Current-Max | 1.04 mA | |
| Supply Voltage-Max | 14 V | |
| Supply Voltage-Min | 4.5 V | |
| Supply Voltage-Nom | 12 V | |
| Supply Voltage1-Max | 60 V | |
| Supply Voltage1-Min | 4.5 V | |
| Supply Voltage1-Nom | 12 V | |
| Surface Mount | YES | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Turn-off Time | 0.046 µs | |
| Turn-on Time | 0.04 µs | |
| Width | 3 mm |
Alternate Parts for HIP2103FRTAAZ-T
This table gives cross-reference parts and alternative options found for HIP2103FRTAAZ-T. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HIP2103FRTAAZ-T, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| HIP2103FRTAAZ-T7 | Renesas Electronics Corporation | Check for Price | Half Bridge Based MOSFET Driver | HIP2103FRTAAZ-T vs HIP2103FRTAAZ-T7 |
| HIP2103FRTAAZ | Renesas Electronics Corporation | Check for Price | 60V, 1A/2A Peak, Half Bridge Driver with 4V UVLO, TDFN, /Tube | HIP2103FRTAAZ-T vs HIP2103FRTAAZ |
| HIP2103FRTAAZ-T7A | Renesas Electronics Corporation | Check for Price | 60V, 1A/2A Peak, Half Bridge Driver with 4V UVLO, TDFN, /Reel | HIP2103FRTAAZ-T vs HIP2103FRTAAZ-T7A |
HIP2103FRTAAZ-T Frequently Asked Questions (FAQ)
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A 4-layer PCB with a solid ground plane and thermal vias is recommended. The HIP2103FRTAAZ-T has an exposed thermal pad, so a thermal relief pattern on the PCB is necessary to ensure good thermal conductivity.
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Ensure that the device is properly heatsinked, and the thermal pad is connected to a solid ground plane. Also, follow the recommended operating conditions and derating guidelines in the datasheet.
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The maximum allowed voltage on the VIN pin is 36V, but it's recommended to keep it below 30V to ensure reliable operation and minimize the risk of damage.
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Yes, but ensure that the device is properly heatsinked and the thermal design is adequate. The device can handle high currents, but excessive heat can reduce its lifespan.
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Check the input voltage, output voltage, and current. Verify that the device is properly heatsinked and that the thermal pad is connected to a solid ground plane. Consult the datasheet and application notes for troubleshooting guidelines.