Part Details for HYB18T512400B2FL-5 by Qimonda AG
Overview of HYB18T512400B2FL-5 by Qimonda AG
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Applications
Consumer Electronics
Environmental Monitoring
Internet of Things (IoT)
Computing and Data Storage
Aerospace and Defense
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Electronic Manufacturing
Entertainment and Gaming
Part Details for HYB18T512400B2FL-5
HYB18T512400B2FL-5 CAD Models
HYB18T512400B2FL-5 Part Data Attributes
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HYB18T512400B2FL-5
Qimonda AG
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Datasheet
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HYB18T512400B2FL-5
Qimonda AG
DDR DRAM, 128MX4, 0.6ns, CMOS, PBGA60
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | QIMONDA AG | |
| Package Description | FBGA, BGA60,9X11,32 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.28 | |
| Access Time-Max | 0.6 ns | |
| Clock Frequency-Max (fCLK) | 200 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 4,8 | |
| JESD-30 Code | R-PBGA-B60 | |
| Memory Density | 536870912 bit | |
| Memory IC Type | DDR2 DRAM | |
| Memory Width | 4 | |
| Number of Terminals | 60 | |
| Number of Words | 134217728 words | |
| Number of Words Code | 128000000 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 128MX4 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA60,9X11,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Qualification Status | Not Qualified | |
| Refresh Cycles | 8192 | |
| Sequential Burst Length | 4,8 | |
| Standby Current-Max | 0.003 A | |
| Supply Current-Max | 0.14 mA | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM |