Part Details for ICS97ULPA877AKLF-T by Integrated Device Technology Inc
Overview of ICS97ULPA877AKLF-T by Integrated Device Technology Inc
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Applications
Telecommunications
Communication and Networking
Part Details for ICS97ULPA877AKLF-T
ICS97ULPA877AKLF-T CAD Models
ICS97ULPA877AKLF-T Part Data Attributes
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ICS97ULPA877AKLF-T
Integrated Device Technology Inc
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Datasheet
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ICS97ULPA877AKLF-T
Integrated Device Technology Inc
PLL Based Clock Driver, 97ULP Series, 10 True Output(s), 0 Inverted Output(s), PQCC40, ROHS COMPLIANT, PLASTIC, MLF-40
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
| Part Package Code | DFN | |
| Package Description | HVQCCN, | |
| Pin Count | 40 | |
| Manufacturer Package Code | MLF | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Family | 97ULP | |
| Input Conditioning | DIFFERENTIAL | |
| JESD-30 Code | S-PQCC-N40 | |
| JESD-609 Code | e3 | |
| Length | 6 mm | |
| Logic IC Type | PLL BASED CLOCK DRIVER | |
| Number of Functions | 1 | |
| Number of Inverted Outputs | ||
| Number of Terminals | 40 | |
| Number of True Outputs | 10 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HVQCCN | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Qualification Status | Not Qualified | |
| Same Edge Skew-Max (tskwd) | 0.04 ns | |
| Seated Height-Max | 1 mm | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Width | 6 mm |