Part Details for IS22ES08G-JCLA1 by Integrated Silicon Solution Inc
Results Overview of IS22ES08G-JCLA1 by Integrated Silicon Solution Inc
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- Tariff Estimator: (Available) NEW
- Number of Functional Equivalents: (0 options)
- CAD Models: (Available)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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IS22ES08G-JCLA1 Information
IS22ES08G-JCLA1 by Integrated Silicon Solution Inc is a Flash Memory.
Flash Memories are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for IS22ES08G-JCLA1
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
IS22ES08G-JCLA1
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Avnet Silica | (Alt: IS22ES08G-JCLA1) RoHS: Compliant Min Qty: 152 Package Multiple: 152 Lead time: 14 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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Chip Stock | NANDFlashMemorywitheMMC5.0Interface8GB0-200MHzAutomotiveGrade-40to85°C153-BallFBGA | 3600 |
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RFQ |
US Tariff Estimator: IS22ES08G-JCLA1 by Integrated Silicon Solution Inc
Calculations from this tool are estimations only for imports into the United States. Please refer to the distributor or manufacturer and reference official US government sources and authorities to verify any final purchase costs.
Part Details for IS22ES08G-JCLA1
IS22ES08G-JCLA1 CAD Models
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IS22ES08G-JCLA1 Part Data Attributes
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IS22ES08G-JCLA1
Integrated Silicon Solution Inc
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Datasheet
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IS22ES08G-JCLA1
Integrated Silicon Solution Inc
Flash, 8GX8, PBGA153, FBGA-153
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
| Package Description | FBGA-153 | |
| Reach Compliance Code | Compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Factory Lead Time | 53 Weeks, 1 Day | |
| Date Of Intro | 2016-09-13 | |
| Samacsys Manufacturer | Integrated Silicon Solution Inc. | |
| Alternate Memory Width | 1 | |
| Clock Frequency-Max (fCLK) | 200 MHz | |
| Command User Interface | NO | |
| Data Polling | NO | |
| JESD-30 Code | R-PBGA-B153 | |
| JESD-609 Code | e1 | |
| Length | 13 mm | |
| Memory Density | 68719476736 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 153 | |
| Number of Words | 8589934592 words | |
| Number of Words Code | 8000000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 8GX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Equivalence Code | BGA153,14X14,20 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programming Voltage | 3.3 V | |
| Screening Level | AEC-Q100 | |
| Seated Height-Max | 1 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 10 | |
| Toggle Bit | NO | |
| Type | MLC NAND TYPE | |
| Width | 11.5 mm |
IS22ES08G-JCLA1 Frequently Asked Questions (FAQ)
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The recommended operating temperature range for the IS22ES08G-JCLA1 is -40°C to 85°C.
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To ensure data integrity, it is recommended to follow the power-down and power-up sequences outlined in the datasheet, and to use the chip enable (CE) and write enable (WE) signals to control access to the device.
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The maximum clock frequency supported by the IS22ES08G-JCLA1 is 104 MHz.
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Page writes and block erases should be performed using the commands outlined in the datasheet, and the device should be in the correct state (e.g. write enable, block protect) before performing these operations.
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The WP (Write Protect) pin is used to prevent accidental writes to the device. When the WP pin is tied low, the device is in a write-protected state, and writes are inhibited.