Memory
K3N6V1000E-GC100
Samsung Semiconductor
Description: MASK ROM, 2MX16, 100ns, CMOS, PDSO44, 0.600 INCH, SOP-44

Overview of K3N6V1000E-GC100 by Samsung Semiconductor

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Where used in Applications: Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Automotive Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Entertainment and Gaming

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Part Data Attributes for K3N6V1000E-GC100 by Samsung Semiconductor

K3N6V1000E-GC100
Samsung Semiconductor
-
-
Rohs Code
No
Part Life Cycle Code
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
Part Package Code
SOIC
Package Description
SOP,
Pin Count
44
Reach Compliance Code
compliant
ECCN Code
EAR99
HTS Code
8542.32.00.71
Access Time-Max
100 ns
Alternate Memory Width
8
JESD-30 Code
R-PDSO-G44
Length
28.5 mm
Memory Density
33554432 bit
Memory IC Type
MASK ROM
Memory Width
16
Number of Functions
1
Number of Terminals
44
Number of Words
2097152 words
Number of Words Code
2000000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
2MX16
Package Body Material
PLASTIC/EPOXY
Package Code
SOP
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
225
Qualification Status
Not Qualified
Seated Height-Max
3.1 mm
Supply Current-Max
0.04 mA
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
3.3 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
GULL WING
Terminal Pitch
1.27 mm
Terminal Position
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
12.6 mm
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  1. K3N6V1000E-GC100
    Samsung Semiconductor
    MASK ROM, 2MX16, 100ns, CMOS, PDSO44, 0.600 INCH, SOP-44
    VS

Alternate Parts for K3N6V1000E-GC100

This table gives cross-reference parts and alternative options found for K3N6V1000E-GC100. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K3N6V1000E-GC100, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
K3N6V1000E-GC10 MASK ROM, 2MX16, 100ns, CMOS, PDSO44, 0.600 INCH, SOP-44 Samsung Semiconductor K3N6V1000E-GC100 vs K3N6V1000E-GC10
UPD23C32080ALGX-XXX MASK ROM, 2MX16, 100ns, MOS, PDSO44, 15.24 MM, PLASTIC, SOP-44 NEC Electronics Group K3N6V1000E-GC100 vs UPD23C32080ALGX-XXX
K3N6V1000F-GC100 MASK ROM, 2MX16, 100ns, CMOS, PDSO44, 0.600 INCH, SOP-44 Samsung Semiconductor K3N6V1000E-GC100 vs K3N6V1000F-GC100
UPD23C32040ALGX-XXX-A MASK ROM, 2MX16, 100ns, MOS, PDSO44, 15.24 MM, LEAD FREE, PLASTIC, SOP-44 NEC Electronics America Inc K3N6V1000E-GC100 vs UPD23C32040ALGX-XXX-A
UPD23C32000ALGX-XXX-A 2MX16 MASK PROM, 100ns, PDSO44, 15.24 MM, LEAD FREE, PLASTIC, SOP-44 Renesas Electronics Corporation K3N6V1000E-GC100 vs UPD23C32000ALGX-XXX-A
MX23L3211MC-10 MASK ROM, 2MX16, 100ns, CMOS, PDSO44, 0.500 INCH, MO-175, SOP-44 Macronix International Co Ltd K3N6V1000E-GC100 vs MX23L3211MC-10
K3P6V1000B-GC10 MASK ROM, 2MX16, 100ns, CMOS, PDSO44, 0.600 INCH, SOP-44 Samsung Semiconductor K3N6V1000E-GC100 vs K3P6V1000B-GC10
K3P6V1000B-GC100 MASK ROM, 2MX16, 100ns, CMOS, PDSO44, 0.600 INCH, SOP-44 Samsung Semiconductor K3N6V1000E-GC100 vs K3P6V1000B-GC100
KM23V32005BG-10 MASK ROM, 2MX16, 100ns, CMOS, PDSO44, 0.600 INCH, SOP-44 Samsung Semiconductor K3N6V1000E-GC100 vs KM23V32005BG-10
K3P6V1000F-GC10 MASK ROM, 2MX16, 100ns, CMOS, PDSO44, 0.500 INCH, SOP-44 Samsung Semiconductor K3N6V1000E-GC100 vs K3P6V1000F-GC10
Part Number Description Manufacturer Compare
KM23C32005BG-12 MASK ROM, 2MX16, 120ns, CMOS, PDSO44, 0.600 INCH, SOP-44 Samsung Semiconductor K3N6V1000E-GC100 vs KM23C32005BG-12
KM23V32005BG-12 MASK ROM, 2MX16, 120ns, CMOS, PDSO44, 0.600 INCH, SOP-44 Samsung Semiconductor K3N6V1000E-GC100 vs KM23V32005BG-12
K3N6C1500C-TE15 MASK ROM, 4MX8, 150ns, CMOS, PDSO44, TSOP2-44 Samsung Semiconductor K3N6V1000E-GC100 vs K3N6C1500C-TE15
MR533252J-XXMA MASK ROM, 2MX16, CMOS, PDSO44, 0.600 INCH, 1.27 MM PITCH, PLASTIC, SOP-44 LAPIS Semiconductor Co Ltd K3N6V1000E-GC100 vs MR533252J-XXMA
UPD23C32000LG5-XXX-7JF MASK ROM, 4MX8, 140ns, MOS, PDSO44, 0.400 INCH, PLASTIC, TSOP2-44 NEC Electronics Group K3N6V1000E-GC100 vs UPD23C32000LG5-XXX-7JF
LH5332500N-15 MASK ROM, 4MX8, 150ns, CMOS, PDSO44, 0.600 INCH, PLASTIC, SOP-44 Sharp Corp K3N6V1000E-GC100 vs LH5332500N-15
K3N6V1000E-TC10 MASK ROM, 2MX16, 100ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44 Samsung Semiconductor K3N6V1000E-GC100 vs K3N6V1000E-TC10
AM29F032B150SI 4MX8 FLASH 5V PROM, 150ns, PDSO44, SOP-44 AMD K3N6V1000E-GC100 vs AM29F032B150SI
MX29LV320MTMC-70R Flash, 2MX16, 70ns, PDSO44, 0.500 INCH, MO-175, SOP-44 Macronix International Co Ltd K3N6V1000E-GC100 vs MX29LV320MTMC-70R
K3N6V1000F-GC100 MASK ROM, 2MX16, 100ns, CMOS, PDSO44, 0.600 INCH, SOP-44 Samsung Semiconductor K3N6V1000E-GC100 vs K3N6V1000F-GC100

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