Datasheets
K4D263238M-QC45 by: Samsung Semiconductor

DDR DRAM, 4MX32, 0.7ns, CMOS, PQFP100, 20 X 14 MM, 0.65 MM PITCH, TQFP-100

Part Details for K4D263238M-QC45 by Samsung Semiconductor

Overview of K4D263238M-QC45 by Samsung Semiconductor

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Applications Computing and Data Storage

Part Details for K4D263238M-QC45

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K4D263238M-QC45 Part Data Attributes

K4D263238M-QC45 Samsung Semiconductor
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K4D263238M-QC45 Samsung Semiconductor DDR DRAM, 4MX32, 0.7ns, CMOS, PQFP100, 20 X 14 MM, 0.65 MM PITCH, TQFP-100
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Part Package Code QFP
Package Description TQFP, TQFP100,.7X.9
Pin Count 100
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.02
Access Mode FOUR BANK PAGE BURST
Access Time-Max 0.7 ns
Additional Feature AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 222 MHz
I/O Type COMMON
Interleaved Burst Length 2,4,8
JESD-30 Code R-PQFP-G100
JESD-609 Code e0
Length 20 mm
Memory Density 134217728 bit
Memory IC Type DDR1 DRAM
Memory Width 32
Number of Functions 1
Number of Ports 1
Number of Terminals 100
Number of Words 4194304 words
Number of Words Code 4000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 65 °C
Operating Temperature-Min
Organization 4MX32
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code TQFP
Package Equivalence Code TQFP100,.7X.9
Package Shape RECTANGULAR
Package Style FLATPACK, THIN PROFILE
Qualification Status Not Qualified
Refresh Cycles 4096
Seated Height-Max 1.2 mm
Self Refresh YES
Sequential Burst Length 2,4,8,FP
Standby Current-Max 0.09 A
Supply Current-Max 0.6 mA
Supply Voltage-Max (Vsup) 2.625 V
Supply Voltage-Min (Vsup) 2.375 V
Supply Voltage-Nom (Vsup) 2.5 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING
Terminal Pitch 0.65 mm
Terminal Position QUAD
Width 14 mm

Alternate Parts for K4D263238M-QC45

This table gives cross-reference parts and alternative options found for K4D263238M-QC45. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K4D263238M-QC45, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
EDD1232AAFA-6B-E DDR DRAM, 4MX32, 0.7ns, CMOS, PQFP100, ROHS COMPLIANT, PLASTIC, LQFP-100 Elpida Memory Inc K4D263238M-QC45 vs EDD1232AAFA-6B-E
K4D263238F-QC50 DDR DRAM, 4MX32, 0.7ns, CMOS, PQFP100, 20 X 14 MM, 0.65 MM PITCH, TQFP-100 Samsung Semiconductor K4D263238M-QC45 vs K4D263238F-QC50
K4D263238I-QC500 DDR DRAM, 4MX32, 0.7ns, CMOS, PQFP100, 20 X 14 MM, 0.65 MM PITCH, TQFP-100 Samsung Semiconductor K4D263238M-QC45 vs K4D263238I-QC500
M13S128324A-5LG DDR DRAM, 4MX32, 0.7ns, CMOS, PQFP100, 14 X 20 MM, 0.65 MM PITCH, LEAD FREE, LQFP-100 Elite Semiconductor Memory Technology Inc K4D263238M-QC45 vs M13S128324A-5LG
MT46V4M32LG-45 DDR DRAM, 4MX32, 0.7ns, CMOS, PQFP100, 0.65 MM PITCH, PLASTIC, TQFP-100 Micron Technology Inc K4D263238M-QC45 vs MT46V4M32LG-45
K4D263238I-UC500 DDR DRAM, 4MX32, 0.7ns, CMOS, PQFP100, 20 X 14 MM, 0.65 MM PITCH, LEAD FREE, TQFP-100 Samsung Semiconductor K4D263238M-QC45 vs K4D263238I-UC500
K4D263238F-QC500 DDR DRAM, 4MX32, 0.7ns, CMOS, PQFP100, 20 X 14 MM, 0.65 MM PITCH, TQFP-100 Samsung Semiconductor K4D263238M-QC45 vs K4D263238F-QC500
K4D263238M-QC500 DDR DRAM, 4MX32, 0.7ns, CMOS, PQFP100, 20 X 14 MM, 0.65 MM PITCH, TQFP-100 Samsung Semiconductor K4D263238M-QC45 vs K4D263238M-QC500
MT46V4M32LG-4 DDR DRAM, 4MX32, 0.7ns, CMOS, PQFP100, 0.65 MM PITCH, PLASTIC, TQFP-100 Micron Technology Inc K4D263238M-QC45 vs MT46V4M32LG-4
MT46V4M32V1LG-5 DDR DRAM, 4MX32, 0.7ns, CMOS, PQFP100, 0.65 MM PITCH, PLASTIC, TQFP-100 Micron Technology Inc K4D263238M-QC45 vs MT46V4M32V1LG-5
Part Number Description Manufacturer Compare
HY5DU283222AQ-5 DDR DRAM, 4MX32, 0.7ns, CMOS, PQFP100, 20 X 14 MM, 0.65 MM PITCH, LQFP-100 SK Hynix Inc K4D263238M-QC45 vs HY5DU283222AQ-5
EDD1232AAFA-5C-E DDR DRAM, 4MX32, 0.7ns, CMOS, PQFP100, LEAD FREE, PLASTIC, LQFP-100 Elpida Memory Inc K4D263238M-QC45 vs EDD1232AAFA-5C-E
EDD1232AAFA-6B-E DDR DRAM, 4MX32, 0.7ns, CMOS, PQFP100, ROHS COMPLIANT, PLASTIC, LQFP-100 Elpida Memory Inc K4D263238M-QC45 vs EDD1232AAFA-6B-E
HY5DU283222AQ-4 DDR DRAM, 4MX32, 0.7ns, CMOS, PQFP100, 20 X 14 MM, 0.65 MM PITCH, LQFP-100 SK Hynix Inc K4D263238M-QC45 vs HY5DU283222AQ-4
MS82V16520-7GA Video DRAM, 4MX32, 6ns, CMOS, PQFP100, 14 X 20 MM, 0.65 MM PITCH, PLASTIC, QFP-100 OKI Electric Industry Co Ltd K4D263238M-QC45 vs MS82V16520-7GA
K4D263238M-QC550 DDR DRAM, 4MX32, 0.75ns, CMOS, PQFP100, 20 X 14 MM, 0.65 MM PITCH, TQFP-100 Samsung Semiconductor K4D263238M-QC45 vs K4D263238M-QC550
MT46V4M32V1LG-5 DDR DRAM, 4MX32, 0.7ns, CMOS, PQFP100, 0.65 MM PITCH, PLASTIC, TQFP-100 Micron Technology Inc K4D263238M-QC45 vs MT46V4M32V1LG-5
K4D263238F-QC40 DDR DRAM, 4MX32, 0.6ns, CMOS, PQFP100, 20 X 14 MM, 0.65 MM PITCH, TQFP-100 Samsung Semiconductor K4D263238M-QC45 vs K4D263238F-QC40
M13S128324A-4LG DDR DRAM, 4MX32, 0.7ns, CMOS, PQFP100, 14 X 20 MM, 0.65 MM PITCH, LEAD FREE, LQFP-100 Elite Semiconductor Memory Technology Inc K4D263238M-QC45 vs M13S128324A-4LG
K4D263238M-QC55 DDR DRAM, 4MX32, 0.75ns, CMOS, PQFP100, 20 X 14 MM, 0.65 MM PITCH, TQFP-100 Samsung Semiconductor K4D263238M-QC45 vs K4D263238M-QC55

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