Part Details for K8D3216UBC-PI09 by Samsung Semiconductor
Overview of K8D3216UBC-PI09 by Samsung Semiconductor
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Part Details for K8D3216UBC-PI09
K8D3216UBC-PI09 CAD Models
K8D3216UBC-PI09 Part Data Attributes
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K8D3216UBC-PI09
Samsung Semiconductor
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Datasheet
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K8D3216UBC-PI09
Samsung Semiconductor
Flash, 2MX16, 90ns, PDSO48
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | |
| Package Description | TSSOP, TSSOP48,.8,20 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 90 ns | |
| Alternate Memory Width | 8 | |
| Boot Block | BOTTOM | |
| Command User Interface | YES | |
| Common Flash Interface | YES | |
| Data Polling | YES | |
| JESD-30 Code | R-PDSO-G48 | |
| Memory Density | 33554432 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 16 | |
| Number of Sectors/Size | 8,63 | |
| Number of Terminals | 48 | |
| Number of Words | 2097152 words | |
| Number of Words Code | 2000000 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 2MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSSOP | |
| Package Equivalence Code | TSSOP48,.8,20 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Ready/Busy | YES | |
| Sector Size | 8K,64K | |
| Standby Current-Max | 0.000018 A | |
| Supply Current-Max | 0.05 mA | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | DUAL | |
| Toggle Bit | YES | |
| Type | NOR TYPE |