Part Details for L-FW323-07-NV129-DT by LSI Corporation
Overview of L-FW323-07-NV129-DT by LSI Corporation
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Part Details for L-FW323-07-NV129-DT
L-FW323-07-NV129-DT CAD Models
L-FW323-07-NV129-DT Part Data Attributes
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L-FW323-07-NV129-DT
LSI Corporation
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L-FW323-07-NV129-DT
LSI Corporation
Serial I/O Controller, 2 Channel(s), 50MBps, CMOS, PBGA129, ROHS COMPLIANT, VTFSBGAC-129
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | AGERE SYSTEMS INC | |
Part Package Code | BGA | |
Package Description | VFBGA, BGA129,13X13,20 | |
Pin Count | 129 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.31.00.01 | |
Address Bus Width | ||
Boundary Scan | NO | |
Clock Frequency-Max | 24.578 MHz | |
Communication Protocol | ASYNC, BIT | |
Data Transfer Rate-Max | 50 MBps | |
External Data Bus Width | ||
JESD-30 Code | S-PBGA-B129 | |
Length | 7 mm | |
Low Power Mode | YES | |
Number of Serial I/Os | 2 | |
Number of Terminals | 129 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | VFBGA | |
Package Equivalence Code | BGA129,13X13,20 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
Seated Height-Max | 0.98 mm | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | BALL | |
Terminal Pitch | 0.5 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 7 mm | |
uPs/uCs/Peripheral ICs Type | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |