Part Details for LCMXO640E-3FN256C by Lattice Semiconductor Corporation
Overview of LCMXO640E-3FN256C by Lattice Semiconductor Corporation
- Distributor Offerings:
- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Part Details for LCMXO640E-3FN256C
LCMXO640E-3FN256C CAD Models
LCMXO640E-3FN256C Part Data Attributes
|
LCMXO640E-3FN256C
Lattice Semiconductor Corporation
Buy Now
Datasheet
|
Compare Parts:
LCMXO640E-3FN256C
Lattice Semiconductor Corporation
Flash PLD, 4.9ns, CMOS, PBGA256, 17 X 17 MM, ROHS COMPLIANT, FPBGA-256
|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | LATTICE SEMICONDUCTOR CORP | |
Part Package Code | BGA | |
Package Description | 17 X 17 MM, ROHS COMPLIANT, FPBGA-256 | |
Pin Count | 256 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 | |
Clock Frequency-Max | 388 MHz | |
JESD-30 Code | S-PBGA-B256 | |
JESD-609 Code | e1 | |
Length | 17 mm | |
Moisture Sensitivity Level | 3 | |
Number of Dedicated Inputs | 7 | |
Number of I/O Lines | 159 | |
Number of Inputs | 159 | |
Number of Logic Cells | 640 | |
Number of Outputs | 159 | |
Number of Terminals | 256 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | ||
Organization | 7 DEDICATED INPUTS, 159 I/O | |
Output Function | MACROCELL | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA256,16X16,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 250 | |
Programmable Logic Type | FLASH PLD | |
Propagation Delay | 4.9 ns | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2.1 mm | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
Supply Voltage-Nom | 1.2 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 17 mm |
Alternate Parts for LCMXO640E-3FN256C
This table gives cross-reference parts and alternative options found for LCMXO640E-3FN256C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of LCMXO640E-3FN256C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
LCMXO640E-3F256I | Flash PLD, 4.9ns, CMOS, PBGA256, 17 X 17 MM, FPBGA-256 | Lattice Semiconductor Corporation | LCMXO640E-3FN256C vs LCMXO640E-3F256I |
LCMXO640E-3F256C | Flash PLD, 4.9ns, CMOS, PBGA256, 17 X 17 MM, FPBGA-256 | Lattice Semiconductor Corporation | LCMXO640E-3FN256C vs LCMXO640E-3F256C |