Part Details for LM2612ATLX/NOPB by National Semiconductor Corporation
Overview of LM2612ATLX/NOPB by National Semiconductor Corporation
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Part Details for LM2612ATLX/NOPB
LM2612ATLX/NOPB CAD Models
LM2612ATLX/NOPB Part Data Attributes
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LM2612ATLX/NOPB
National Semiconductor Corporation
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Datasheet
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LM2612ATLX/NOPB
National Semiconductor Corporation
IC,SMPS CONTROLLER,CURRENT/VOLTAGE,CMOS,BGA,10PIN,PLASTIC
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NATIONAL SEMICONDUCTOR CORP | |
| Package Description | FBGA, BGA10,3X4,20 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Control Mode | CURRENT/VOLTAGE-MODE | |
| JESD-30 Code | R-PBGA-B10 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 1 | |
| Number of Terminals | 10 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -25 °C | |
| Output Current-Max | 0.4 A | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA10,3X4,20 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Surface Mount | YES | |
| Switching Frequency-Max | 1000 kHz | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 |