Part Details for LMC6582BIN by Texas Instruments
Overview of LMC6582BIN by Texas Instruments
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (1 cross)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (2 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for LMC6582BIN
LMC6582BIN CAD Models
LMC6582BIN Part Data Attributes:
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LMC6582BIN
Texas Instruments
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LMC6582BIN
Texas Instruments
DUAL OP-AMP, 3000uV OFFSET-MAX, 1.2MHz BAND WIDTH, PDIP8, PLASTIC, DIP-8
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NATIONAL SEMICONDUCTOR CORP | |
Package Description | DIP, DIP8,.3 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.33.00.01 | |
Amplifier Type | OPERATIONAL AMPLIFIER | |
Architecture | VOLTAGE-FEEDBACK | |
Common-mode Reject Ratio-Nom | 82 dB | |
Frequency Compensation | YES | |
Input Offset Voltage-Max | 3000 µV | |
JESD-30 Code | R-PDIP-T8 | |
JESD-609 Code | e0 | |
Length | 9.8171 mm | |
Low-Bias | YES | |
Low-Offset | NO | |
Micropower | NO | |
Neg Supply Voltage-Nom (Vsup) | ||
Number of Functions | 2 | |
Number of Terminals | 8 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | DIP | |
Package Equivalence Code | DIP8,.3 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Packing Method | RAIL | |
Power | NO | |
Programmable Power | NO | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.08 mm | |
Slew Rate-Nom | 1.2 V/us | |
Supply Current-Max | 3.6 mA | |
Supply Voltage Limit-Max | 12 V | |
Supply Voltage-Nom (Vsup) | 10 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Unity Gain BW-Nom | 1200 | |
Voltage Gain-Min | 10000 | |
Wideband | NO | |
Width | 7.62 mm |
Alternate Parts for LMC6582BIN
This table gives cross-reference parts and alternative options found for LMC6582BIN. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of LMC6582BIN, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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LMC6582BIN | IC DUAL OP-AMP, 3000 uV OFFSET-MAX, 1.2 MHz BAND WIDTH, PDIP8, PLASTIC, DIP-8, Operational Amplifier | National Semiconductor Corporation | LMC6582BIN vs LMC6582BIN |