Part Details for LPC1810FBD144,551 by NXP Semiconductors
Overview of LPC1810FBD144,551 by NXP Semiconductors
- Distributor Offerings: (10 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for LPC1810FBD144,551
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
78T6051
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Newark | High Performance 32-Bit Microcontroller Based On Arm Cortex-M3/ Tray Rohs Compliant: Yes |Nxp LPC1810FBD144,551 RoHS: Compliant Min Qty: 60 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
$6.3600 / $8.4200 | Buy Now |
DISTI #
2156-LPC1810FBD144,551-ND
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DigiKey | IC MCU 32BIT ROMLESS 144LQFP Min Qty: 41 Lead time: 13 Weeks Container: Bulk MARKETPLACE PRODUCT |
41 In Stock |
|
$8.7800 | Buy Now |
DISTI #
LPC1810FBD144,551-ND
|
DigiKey | IC MCU 32BIT ROMLESS 144LQFP Min Qty: 41 Lead time: 13 Weeks Container: Tray | Temporarily Out of Stock |
|
$7.2517 | Buy Now |
DISTI #
LPC1810FBD144,551
|
Avnet Americas | MCU 32-bit LPC1800 ARM Cortex M3 RISC ROMLess 2.5V/3.3V 144-Pin LQFP Tray - Trays (Alt: LPC1810FBD144,551) RoHS: Compliant Min Qty: 120 Package Multiple: 60 Lead time: 13 Weeks, 0 Days Container: Tray | 0 |
|
$5.1402 | Buy Now |
DISTI #
771-LPC1810FBD144551
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Mouser Electronics | ARM Microcontrollers - MCU Cortex-M3 136kB SRAM 136 kB SRAM RoHS: Compliant | 60 |
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$7.3200 / $12.9100 | Buy Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 120 Package Multiple: 60 Lead time: 13 Weeks Container: Tray | 0Tray |
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$5.8500 | Buy Now |
|
Rochester Electronics | LPC1810 - High Performance 32-bit Microcontroller based on ARM Cortex-M3 RoHS: Compliant Status: Active Min Qty: 1 | 41 |
|
$7.5300 / $8.8600 | Buy Now |
DISTI #
LPC1810FBD144,551
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Avnet Silica | MCU 32-bit LPC1800 ARM Cortex M3 RISC ROMLess 2.5V/3.3V 144-Pin LQFP Tray (Alt: LPC1810FBD144,551) RoHS: Compliant Min Qty: 60 Package Multiple: 60 Lead time: 15 Weeks, 0 Days | Silica - 0 |
|
Buy Now | |
DISTI #
LPC1810FBD144,551
|
EBV Elektronik | MCU 32-bit LPC1800 ARM Cortex M3 RISC ROMLess 2.5V/3.3V 144-Pin LQFP Tray (Alt: LPC1810FBD144,551) RoHS: Compliant Min Qty: 60 Package Multiple: 60 Lead time: 15 Weeks, 0 Days | EBV - 0 |
|
Buy Now | |
|
Flip Electronics | Stock | 43 |
|
RFQ |
Part Details for LPC1810FBD144,551
LPC1810FBD144,551 CAD Models
LPC1810FBD144,551 Part Data Attributes
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LPC1810FBD144,551
NXP Semiconductors
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Datasheet
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LPC1810FBD144,551
NXP Semiconductors
LPC1810FBD144 - High Performance 32-bit Microcontroller based on ARM Cortex-M3 QFP 144-Pin
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | QFP | |
Package Description | 20 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT486-1, LQFP-144 | |
Pin Count | 144 | |
Manufacturer Package Code | SOT486-1 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Factory Lead Time | 13 Weeks | |
Samacsys Manufacturer | NXP | |
Has ADC | YES | |
Address Bus Width | 24 | |
Bit Size | 32 | |
CPU Family | CORTEX-M3 | |
Clock Frequency-Max | 25 MHz | |
DAC Channels | YES | |
DMA Channels | YES | |
External Data Bus Width | 32 | |
JESD-30 Code | S-PQFP-G144 | |
JESD-609 Code | e3 | |
Length | 20 mm | |
Moisture Sensitivity Level | 3 | |
Number of I/O Lines | 83 | |
Number of Terminals | 144 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFQFP | |
Package Equivalence Code | QFP144,.87SQ,20 | |
Package Shape | SQUARE | |
Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
RAM (bytes) | 139264 | |
ROM (words) | 65536 | |
ROM Programmability | FLASH | |
Seated Height-Max | 1.6 mm | |
Speed | 180 MHz | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3.3 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 20 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |