Part Details for LPC2364FBD100 by NXP Semiconductors
Results Overview of LPC2364FBD100 by NXP Semiconductors
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 replacements)
- Tariff Estimator: (Available) NEW
- Number of Functional Equivalents: (3 options)
- CAD Models: (Request Part)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
LPC2364FBD100 Information
LPC2364FBD100 by NXP Semiconductors is a Microcontroller.
Microcontrollers are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for LPC2364FBD100
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
LPC2364FBD100
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TME | IC: ARM7TDMI microcontroller, 34kBSRAM, Flash: 128kx8bit, LQFP100 Min Qty: 1 | 0 |
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$8.0600 / $12.5500 | RFQ |
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Chip Stock | MicrocontrollerMcu,32Bit,ARM7TDMI,72MHZ,LQFP-100 | 3700 |
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RFQ | |
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Vyrian | Peripheral ICs | 1383 |
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RFQ | |
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Win Source Electronics | IC MCU 32BIT 128KB FLASH 100LQFP | 2200 |
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$10.9091 / $16.3637 | Buy Now |
US Tariff Estimator: LPC2364FBD100 by NXP Semiconductors
Calculations from this tool are estimations only for imports into the United States. Please refer to the distributor or manufacturer and reference official US government sources and authorities to verify any final purchase costs.
Part Details for LPC2364FBD100
LPC2364FBD100 Part Data Attributes
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LPC2364FBD100
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
LPC2364FBD100
NXP Semiconductors
IC 32-BIT, FLASH, 72 MHz, RISC MICROCONTROLLER, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT407-1, LQFP-100, Microcontroller
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Part Package Code | QFP | |
| Package Description | Lfqfp, Qfp100,.63sq,20 | |
| Pin Count | 100 | |
| Reach Compliance Code | Compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Has ADC | Yes | |
| Address Bus Width | ||
| Bit Size | 32 | |
| Boundary Scan | Yes | |
| CPU Family | Arm7 | |
| Clock Frequency-Max | 25 Mhz | |
| DAC Channels | Yes | |
| DMA Channels | Yes | |
| External Data Bus Width | 16 | |
| JESD-30 Code | S-PQFP-G100 | |
| JESD-609 Code | e3 | |
| Length | 14 Mm | |
| Moisture Sensitivity Level | 3 | |
| Number of I/O Lines | 70 | |
| Number of Terminals | 100 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | Yes | |
| Package Body Material | Plastic/Epoxy | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP100,.63SQ,20 | |
| Package Shape | Square | |
| Package Style | Flatpack, Low Profile, Fine Pitch | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 34816 | |
| ROM (words) | 131072 | |
| ROM Programmability | Flash | |
| Seated Height-Max | 1.6 Mm | |
| Speed | 72 Mhz | |
| Supply Current-Max | 100 Ma | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3.3 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | Yes | |
| Technology | Cmos | |
| Temperature Grade | Industrial | |
| Terminal Finish | Tin (Sn) | |
| Terminal Form | Gull Wing | |
| Terminal Pitch | 0.5 Mm | |
| Terminal Position | Quad | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 14 Mm | |
| uPs/uCs/Peripheral ICs Type | Microcontroller, Risc |
Alternate Parts for LPC2364FBD100
This table gives cross-reference parts and alternative options found for LPC2364FBD100. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of LPC2364FBD100, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| LPC2364FET100,518 | NXP Semiconductors | $13.0126 | LPC2364FET100 - ARM7 with 128 kB flash, 34 kB SRAM, Ethernet, USB 2.0 Device, CAN, and 10-bit ADC BGA 100-Pin | LPC2364FBD100 vs LPC2364FET100,518 |
| LPC2364FBD100,551 | NXP Semiconductors | Check for Price | LPC2364FBD100 - ARM7 with 128 kB flash, 34 kB SRAM, Ethernet, USB 2.0 Device, CAN, and 10-bit ADC QFP 100-Pin | LPC2364FBD100 vs LPC2364FBD100,551 |
| LPC2364HBD100 | NXP Semiconductors | Check for Price | IC 32-BIT, FLASH, 72 MHz, RISC MICROCONTROLLER, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT407-1, LQFP-100, Microcontroller | LPC2364FBD100 vs LPC2364HBD100 |
LPC2364FBD100 Frequently Asked Questions (FAQ)
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The maximum operating temperature range for the LPC2364FBD100 is -40°C to +85°C, as specified in the datasheet. However, it's recommended to operate the device within the industrial temperature range of -40°C to +70°C for optimal performance and reliability.
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The clock settings for the LPC2364FBD100 can be configured using the PLL (Phase-Locked Loop) and the Clock Generation Unit (CGU). The PLL can be used to generate a clock frequency up to 72 MHz, while the CGU allows for clock frequency division and selection. Refer to the datasheet and the NXP LPC2364FBD100 user manual for detailed configuration instructions.
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The maximum current consumption of the LPC2364FBD100 depends on the operating frequency, voltage, and peripherals used. According to the datasheet, the typical current consumption is around 35 mA at 48 MHz and 3.3V. However, this value can increase up to 100 mA or more depending on the specific application and usage.
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Implementing a bootloader for the LPC2364FBD100 involves creating a program that can load and execute application code from an external memory device, such as a flash memory or SD card. NXP provides a bootloader example code and documentation in the LPC2364FBD100 user manual and software development kit (SDK). Additionally, third-party bootloader solutions are also available.
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The LPC2364FBD100's USB interface has some limitations, including a maximum data transfer rate of 12 Mbps, limited to Full-Speed USB (USB 1.1) only, and no support for High-Speed USB (USB 2.0) or USB On-The-Go (OTG). Additionally, the device can only operate as a USB device, not as a USB host.