Part Details for LTC2655BCGN-H16#TRPBF by Linear Technology
Overview of LTC2655BCGN-H16#TRPBF by Linear Technology
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Part Details for LTC2655BCGN-H16#TRPBF
LTC2655BCGN-H16#TRPBF CAD Models
LTC2655BCGN-H16#TRPBF Part Data Attributes
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LTC2655BCGN-H16#TRPBF
Linear Technology
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LTC2655BCGN-H16#TRPBF
Linear Technology
LTC2655 - Quad I<sup>2</sup>C 16-/12-Bit Rail-to-Rail DACs with 10ppm/°C Max Reference; Package: SSOP; Pins: 16; Temperature Range: 0°C to 70°C
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | LINEAR TECHNOLOGY CORP | |
| Part Package Code | SSOP | |
| Package Description | LEAD FREE, PLASTIC, SSOP-16 | |
| Pin Count | 16 | |
| Manufacturer Package Code | GN | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Analog Output Voltage-Max | 4.096 V | |
| Analog Output Voltage-Min | ||
| Converter Type | D/A CONVERTER | |
| Input Bit Code | BINARY | |
| Input Format | SERIAL | |
| JESD-30 Code | R-PDSO-G16 | |
| JESD-609 Code | e3 | |
| Length | 4.9 mm | |
| Linearity Error-Max (EL) | 0.0061% | |
| Moisture Sensitivity Level | 1 | |
| Number of Bits | 16 | |
| Number of Functions | 4 | |
| Number of Terminals | 16 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SSOP | |
| Package Equivalence Code | SSOP16,.25 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, SHRINK PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.75 mm | |
| Settling Time-Nom (tstl) | 9.1 µs | |
| Supply Current-Max | 2.5 mA | |
| Supply Voltage-Nom | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.635 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 3.9 mm |