Part Details for LTM8029IY#PBF by Analog Devices Inc
Results Overview of LTM8029IY#PBF by Analog Devices Inc
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (3 replacements)
- Tariff Estimator: (Available) NEW
- Number of Functional Equivalents: (10 options)
- CAD Models: (Available)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Energy and Power Systems
Renewable Energy
LTM8029IY#PBF Information
LTM8029IY#PBF by Analog Devices Inc is a Switching Regulator or Controller.
Switching Regulator or Controllers are under the broader part category of Power Circuits.
A power circuit delivers electricity in order to operate a load for an electronic device. Power circuits include transformers, generators and switches. Read more about Power Circuits on our Power Circuits part category page.
Price & Stock for LTM8029IY#PBF
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
51AK7586
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Newark | Dc-Dc Converter, 1.2V-18V, 0.6A, Power Supply Applications:Industrial, Dc/Dc Converter Type:Bga-35, Micro Module, Output Power Max:-, Output Voltage Min:1.2V, Output Voltage Max:18V, Output Current Max:600Ma, Height:3.42Mm Rohs Compliant: Yes |Analog Devices LTM8029IY#PBF RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Bulk | 0 |
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$13.0100 / $14.2900 | Buy Now |
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Analog Devices Inc | 36VIN, 600mA Buck µModule Con Package Multiple: 273 | 0 |
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$8.5500 / $14.8400 | Buy Now |
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Bristol Electronics | 3 |
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RFQ | ||
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DISTI #
LTM8029IY#PBF
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Richardson RFPD | DC TO DC CONVERTER RoHS: Compliant Min Qty: 273 | 0 |
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$11.0400 / $12.1200 | Buy Now |
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Chip Stock | ConvDC-DC4.5Vto36VStepDownSingle-Out1.2Vto18V0.6AuModuleAutomotive35-PinBGA | 135 |
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RFQ |
US Tariff Estimator: LTM8029IY#PBF by Analog Devices Inc
Calculations from this tool are estimations only for imports into the United States. Please refer to the distributor or manufacturer and reference official US government sources and authorities to verify any final purchase costs.
Part Details for LTM8029IY#PBF
LTM8029IY#PBF CAD Models
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LTM8029IY#PBF Part Data Attributes
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LTM8029IY#PBF
Analog Devices Inc
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Datasheet
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LTM8029IY#PBF
Analog Devices Inc
36VIN, 600mA Step-Down µModule (Power Module) Converter with 5µA Quiescent Current
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| Pbfree Code | No | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Package Description | Bga, Bga35,5x8,50 | |
| Pin Count | 35 | |
| Manufacturer Package Code | 05-08-1878 | |
| Reach Compliance Code | Compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Additional Feature | Also Operates In Adjustable Mode From 1.2v To 18v | |
| Analog IC - Other Type | Switching Regulator | |
| Control Mode | Current-Mode | |
| Control Technique | Pulse Width Modulation | |
| Input Voltage-Max | 36 V | |
| Input Voltage-Min | 4.5 V | |
| Input Voltage-Nom | 12 V | |
| JESD-30 Code | R-PBGA-B35 | |
| JESD-609 Code | e1 | |
| Length | 11.25 Mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 35 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Output Current-Max | 0.6 A | |
| Output Voltage-Max | 18 V | |
| Output Voltage-Min | 1.2 V | |
| Output Voltage-Nom | 3.3 V | |
| Package Body Material | Plastic/Epoxy | |
| Package Code | BGA | |
| Package Equivalence Code | BGA35,5X8,50 | |
| Package Shape | Rectangular | |
| Package Style | Grid Array | |
| Peak Reflow Temperature (Cel) | 250 | |
| Seated Height-Max | 3.62 Mm | |
| Surface Mount | Yes | |
| Switcher Configuration | Buck | |
| Switching Frequency-Max | 2200 Khz | |
| Technology | Hybrid | |
| Temperature Grade | Automotive | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | Ball | |
| Terminal Pitch | 1.27 Mm | |
| Terminal Position | Bottom | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 6.25 Mm |
Alternate Parts for LTM8029IY#PBF
This table gives cross-reference parts and alternative options found for LTM8029IY#PBF. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of LTM8029IY#PBF, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| LTM8029EY#PBF | Analog Devices Inc | $12.8874 | 36VIN, 600mA Step-Down µModule (Power Module) Converter with 5µA Quiescent Current | LTM8029IY#PBF vs LTM8029EY#PBF |
| LTM8029MPY | Analog Devices Inc | $44.6575 | 36VIN, 600mA Step-Down µModule (Power Module) Converter with 5µA Quiescent Current | LTM8029IY#PBF vs LTM8029MPY |
| LTM8029IY | Linear Technology | Check for Price | LTM8029 - 36VIN, 600mA Step-Down µModule (Power Module) Converter with 5µA Quiescent Current; Package: BGA; Pins: 35; Temperature Range: -40°C to 85°C | LTM8029IY#PBF vs LTM8029IY |
LTM8029IY#PBF Frequently Asked Questions (FAQ)
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A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
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Use a soft-start circuit to limit the inrush current during start-up, and ensure a controlled shutdown sequence to prevent voltage spikes and oscillations.
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Use a combination of X-capacitors, Y-capacitors, and common-mode chokes to filter out electromagnetic interference (EMI). Ensure that the filter components are placed close to the device and connected to a solid ground plane.
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Use a low-noise, high-PSRR LDO regulator, and ensure that the input and output capacitors are of high quality and placed close to the device. Also, use a shielded inductor and a low-ESR output capacitor to minimize noise and voltage ripple.
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Ensure good airflow around the device, use a heat sink or thermal pad, and consider using a thermal interface material (TIM) to improve heat transfer. Also, monitor the device temperature and adjust the design accordingly to prevent overheating.