Part Details for LXT317NE by Cortina Systems Inc
Overview of LXT317NE by Cortina Systems Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for LXT317NE
LXT317NE CAD Models
LXT317NE Part Data Attributes
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LXT317NE
Cortina Systems Inc
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Datasheet
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LXT317NE
Cortina Systems Inc
Baseband Circuit, CMOS, PDIP28, PLASTIC, DIP-28
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| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | CORTINA SYSTEMS INC | |
| Part Package Code | DIP | |
| Package Description | DIP, | |
| Pin Count | 28 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| JESD-30 Code | R-PDIP-T28 | |
| Length | 37.402 mm | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 6.35 mm | |
| Supply Voltage-Nom | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Telecom IC Type | CORDLESS TELEPHONE BASEBAND CIRCUIT | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for LXT317NE
This table gives cross-reference parts and alternative options found for LXT317NE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of LXT317NE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| LXT317PE | Baseband Circuit, CMOS, PQCC28, PLASTIC, LCC-28 | Level One | LXT317NE vs LXT317PE |
| U3550BM-AFLG3 | Support Circuit, PDSO28, SO-28 | Atmel Corporation | LXT317NE vs U3550BM-AFLG3 |
| LXT317PE | Baseband Circuit, CMOS, PQCC28, PLASTIC, LCC-28 | Cortina Systems Inc | LXT317NE vs LXT317PE |
| UBA1707T/C2 | IC TELECOM, CORDLESS, SUPPORT CIRCUIT, PDSO28, PLASTIC, SOT-136, SO-28, Cordless Telephone IC | NXP Semiconductors | LXT317NE vs UBA1707T/C2 |
| UBA1707T-T | IC TELECOM, CORDLESS, SUPPORT CIRCUIT, PDSO28, 7.50 MM, PLASTIC, MS-013AE, SOT-136-1, SOP-28, Cordless Telephone IC | NXP Semiconductors | LXT317NE vs UBA1707T-T |
| UBA1707TS/C2 | IC TELECOM, CORDLESS, SUPPORT CIRCUIT, PDSO28, PLASTIC, SOT-341, SSOP-28, Cordless Telephone IC | NXP Semiconductors | LXT317NE vs UBA1707TS/C2 |
| U2785B-MFS | Support Circuit, Bipolar, PDSO28, SSO-28 | Atmel Corporation | LXT317NE vs U2785B-MFS |
| U2762B-BFSG3 | RF and Baseband Circuit, Bipolar, PDSO28, SSO-28 | Atmel Corporation | LXT317NE vs U2762B-BFSG3 |
| UBA1707T | IC TELECOM, CORDLESS, SUPPORT CIRCUIT, PDSO28, 7.50 MM, PLASTIC, MS-013AE, SOT-136-1, SOP-28, Cordless Telephone IC | NXP Semiconductors | LXT317NE vs UBA1707T |
| AD6190ARSRL | IC TELECOM, CORDLESS, BASEBAND CIRCUIT, PDSO28, SSOP-28, Cordless Telephone IC | Analog Devices Inc | LXT317NE vs AD6190ARSRL |